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Etching equipment

A technology of etching equipment and etching solution, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low production efficiency, increased transportation procedures, and complicated process flow, so as to improve production efficiency and reduce usage. Quantity, the effect of reducing the transfer process

Pending Publication Date: 2018-06-01
成功环保科技(南通)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above process is complicated, the production efficiency is low, additional transfer process is added, and the precision of line etching is low

Method used

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Embodiment Construction

[0036] Below in conjunction with specific embodiment, content of the present invention is described in further detail:

[0037] The "up", "down", "left" and "right" referred to below are consistent with the up, down, left and right directions of the drawings themselves, but do not limit the structure of the invention. In order to achieve the purpose of the present invention, figure 1 , figure 2 , image 3 The front view, top view and left side view of the etching equipment in the present invention are respectively shown. The etching equipment is composed of a frame 1, a carrying device 2, an etching device 4, and a cleaning device 5, among which a carrying device for carrying a wafer or a printed circuit board 3 is provided near the top of the frame 1 2. There is a placement slot on the carrying device 2, the size of which is suitable for the outer dimensions of the wafer or printed circuit board 3, and a clamping device is also arranged on it, which is used for pre-proces...

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PUM

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Abstract

The invention relates to etching equipment. The etching equipment is characterized by comprising a rack, wherein a bearing device is arranged on the rack and is used for bearing a wafer or a printed circuit board, an etching device and a cleaning device are arranged below the bearing device, both can move leftwards and rightwards and are in synchronous linkage, the etching device comprises an etching cutter and an etching liquid pump, the cleaning device comprises a cleaning cutter and a cleaning liquid pump, the etching cutter and the cleaning cutter completely skim over a lower surface of the wafer or the printed circuit board, and a first narrow gap and a second narrow gap are respectively formed in the tops of the etching cutter and the cleaning cutter. A cleaning liquid is sprayed from bottom to top, the residence time of an etching liquid on a pre-processed surface of the wafer or the printed circuit board can be effectively shortened, a pool effect is reduced to a great extent,so that circuit etching precision and accuracy are ensured; and moreover, etching operation and cleaning operation can be sequentially performed on the wafer or the printed circuit board at the same station by the etching equipment, and the process continuousness is ensured.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an etching device. Background technique [0002] With the rapid development of integrated circuit manufacturing, the size of wafers or printed circuit boards is constantly shrinking. In the process of etching wafers or printed circuit boards or removing natural oxide layers on the surface, long-term etching and cleaning processes are required. In the prior art, etching liquid is used to etch the wafer or printed circuit board first, and after the etching is in place, it is put into a cleaning liquid tank for cleaning. The above process is complicated, the production efficiency is low, an additional transfer process is added, and the line etching accuracy is low. Contents of the invention [0003] The problem to be solved by the present invention is to provide an etching device with simple structure, better surface treatment effect of wafer or printed circuit board, ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/306
CPCH01L21/30604H01L21/6704H01L21/67075
Inventor 黄雷
Owner 成功环保科技(南通)有限公司
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