Grinding Pads and Grinding Devices

Abstract

The invention provides a grinding pad and a grinding device, comprising: a plate-shaped pad main body with one side being a grinding surface and the other being a supporting surface; and a plurality of openings, each of which is directed from the grinding surface to the The supporting surface is recessed, and each of the openings extends from a central area close to the pad body to a peripheral area close to the pad main body. A plurality of openings are distributed on the polishing pad, which reduces the contact time between the center of the wafer to be ground and the area of ​​the opening of the polishing pad, thereby reducing the grinding amount of the center of the wafer and making the center of the wafer and the circumference of the wafer The amount of grinding tends to be consistent, improving the flatness of the wafer being ground.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a grinding pad and a grinding device. Background technique [0002] In wafer manufacturing, with the upgrading of process technology and the reduction of critical dimensions, the requirements for the flatness of the wafer surface are getting higher and higher, and the chemical mechanical polishing process has been widely used. The polishing surface of the polishing pad used in chemical mechanical polishing is planar, and the surface to be polished of the wafer and the polishing surface of the polishing pad are arranged parallel to each other, and are polished by mutual rotation and simultaneous contact. Through a series of complex mechanical and chemical actions, the film on the surface of the wafer is removed, so as to achieve the purpose of wafer flattening. [0003] In the actual chemical mechanical polishing process, the flatness of the polish...

AI Technical Summary

Problems solved by technology

[0003] In the actual chemical mechanical polishing process, the flatness of the polished wafer is poor due to the inconsistent grinding amount on the polished surface of the wafer, such as figure 1 As shown, the amount of grinding at the center of the wafer to be ground is relatively large, and the amount of grinding at the circumference of the wafer is relatively small. The poor flatness of the wafer will affect the consistency and performance of multiple chips produced on the wafer.

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