Semiconductor shading film die cutting mechanism

Abstract

The invention discloses a semiconductor shading film die cutting mechanism. The mechanism comprises a bottom plate shell, a first electric push rod, first rotating motors, fixed grooves, second electric push rods, caterpillar bands, limiting plates, a fixed supporting shell, a first connecting block, a first sliding block, a telescopic connecting rod, a second connecting block, a second sliding block, rollers, supporting rods, a second rotating motor, die cutting rollers, rotating connecting shafts, gears, a wind dispersing plate, a fan, a collecting box and a collecting groove. The mechanismhas the beneficial effects that shading films to be machined are pressed and fixed through fixed pressing groove structures, the distance between the fixed pressing groove structures is adjusted, shading films of different lengths can be pressed and fixed, shifting and folding during machining of the shading films during machining can be prevented while pressing and fixing are achieved, and machining precision is improved.

Description

technical field [0001] The invention relates to a die-cutting mechanism, in particular to a semiconductor light-shielding film die-cutting mechanism, which belongs to the application technical field of the light-shielding film die-cutting mechanism. Background technique [0002] The die-cutting mechanism is mainly used for die-cutting (full cut, half-cut), indentation and bronzing operations, lamination, automatic For waste discharge, the die-cutting machine uses steel knives, metal molds, steel wires (or templates carved from steel plates), and applies a certain pressure through the embossing plate to roll and cut the printed matter or cardboard into a certain shape. It is an important equipment for post-press packaging processing and molding. [0003] The semiconductor light-shielding film needs to be fixed during the die-cutting process. Because the surface of the film itself is relatively smooth, it is easy to mishandle during the die-cutting process and cause the raw m...

AI Technical Summary

Problems solved by technology

[0003] The semiconductor light-shielding film needs to be fixed during the die-cutting process. Because the surface of the film itself is relatively smooth, it is easy to mishandle the raw material during the die-cutting process and cause the raw material to shift, resulting in the processed finished product being unqualified.

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