Mixed solvent and method for separating multiple dies in stacked package structure
A technology of mixed solvent and packaging structure, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of mechanical damage to bare chips, corrosion of pads, etc., and achieve the goals of avoiding mechanical damage, improving efficiency, and shortening separation time Effect
Active Publication Date: 2020-02-11
YANGTZE MEMORY TECH CO LTD
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However, both methods have drawbacks. Manual grinding may introduce mechanical damage to the die, while chemical etching may cause corrosion to the pads of the die. Therefore, both methods may cause subsequent electrical measurements to fail. The failure analysis obtains the failure location information of the target die
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[0025] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.
[0026] It should be understood that when describing the structure of a device, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. Also, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, or region.
[0027] If it is to describe the situation directly on another layer or anothe...
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The invention discloses a mixed solvent and method for separating multiple dies in a stacked package structure. The method comprises the steps that a mixed solvent is prepared; the mixed solvent is heated to a predetermined temperature; the stacked package structure is placed in the mixed solvent, so that the protective layer of the stacked package structure is dissolved in the mixed solvent and anumber of dies are separated from each other; and a number of separated dies are cleaned. The method uses the mixed solvent to dissolve the protective layer in the stacked package structure to separate multiple dies, so that multiple dies in the stacked package structure can be separated without damaging the structure integrity of the dies and pads. The separation time is greatly shortened. The efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a mixed solvent and a method for separating a plurality of bare chips in a stacked packaging structure. Background technique [0002] The 3D NAND memory is, for example, a chip with a package-on-package structure, in which multiple dies are stacked and bonded together to form a multi-layer structure to provide greater storage capacity. As the market demands more and more storage capacity of a single memory chip, there are as many as 16 or more layers of bare chips stacked in a stacked package structure. The advantage of using a stacked packaging structure is that the chip has better performance in terms of life, performance, and stability when the storage density increases. [0003] However, failure analysis of chips in package-on-package configurations becomes difficult. When performing failure analysis on a package-on-package structure, if a die in the pac...
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IPC IPC(8): H01L21/02
CPCH01L21/02079
Inventor 漆林仝金雨李辉
Owner YANGTZE MEMORY TECH CO LTD