Embedded substrate, manufacturing method thereof and circuit board with embedded substrate

Abstract

The invention discloses a manufacturing method of an embedded substrate, which comprises the steps of providing a single-sided copper-clad base board; forming a plurality of accommodating grooves forembedding electronic components in the surface, which is back on to the copper-clad side, of the base board, and the depth of each accommodating groove is equal to the thickness of the corresponding electronic component; fixing the plurality of electronic components in the corresponding accommodating grooves; providing a packaging layer, and attaching the packaging layer to the base board to forman embedded body, wherein the packaging layer packages the plurality of electronic components; forming a plurality of avoidance holes in the packaging layer to expose the electrodes of the plurality of electronic components; and performing overall electroplating on the embedded body to form an electroplating layer on the surface of the embedded body so as to form the embedded substrate. The invention also provides an embedded substrate and a circuit board with the embedded substrate.

Description

Technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to an embedded substrate and a manufacturing method thereof, and a circuit board with the embedded substrate. Background technique [0002] In recent years, electronic products have been widely used in daily work and life, and light, thin and small electronic products have become more and more popular. As the main component of electronic products, flexible circuit boards occupies a large space of electronic products. Therefore, the volume of flexible circuit boards largely affects the volume of electronic products. Large-volume flexible circuit boards are bound to be difficult to meet the requirements of electronic products. , Thin, short and small trends. [0003] Embedding the electronic components (such as resistors, capacitors, etc.) of the flexible circuit board in the circuit substrate is beneficial to reduce the overall thickness of the flexible circuit board, thereby red...

AI Technical Summary

Problems solved by technology

However, due to the different heights of multiple electronic components, it is difficult for the embedded structure in the prior art to guarantee the same height from the pads of the electronic components to the copper layer on the surface of the substrate, resulting in different depths of holes that need to be opened when the electronic components are connected.

In the production process, the processing depth of each hole is different, which greatly affects the work efficiency of the substrate during processing, and due to the difference in the embedding depth of the electronic components, the size of the pads of the electronic components when they are connected to the circuit pattern is different. , when forming circuit patterns, it affects the connection effect of electronic components and circuit patterns

Images