Inductance component with down-lead electrode and processing method thereof

Abstract

The invention relates to a method for processing an inductance component, comprising a first step of a base layer preparation phase; a second step of a conductive main structure preparation phase; a third step of an electrical enhancement layer preparation phase; and a fourth step of a terminal electrode preparation phase. In addition, the present invention also discloses an inductance component prepared by using the method, which includes an insulating substrate 1, an insulating substrate 2, an electrical layer, a first insulating layer, an electrical enhancement layer, a second insulating layer, and a terminal electrode. The electrical layer is arranged between the insulating substrate 1 and the insulating substrate 2. The insulating substrate 1 and the insulating substrate 2 include a through hole 1 and a through hole 2, respectively. The electrical layer is disposed on the upper, lower, front and rear sides of the insulating substrate 1 and on the the upper, lower, front and rear sides of the insulating substrate 2. The first insulating layer is disposed on the upper, lower, front and rear sides and the inner wall of the electrical layer. The method for preparing the inductancecomponent effectively reduces the size of the inductance component, and effectively solves the solder tin creeping when the inductance component is soldered.

Description

technical field [0001] The invention relates to an inductance component with a lead-down electrode and a processing method thereof. Background technique [0002] With the advancement of science and technology, the development of electronic products towards thinner and thinner has been driven by the trend. Therefore, components such as resistors, capacitors, and inductors mounted on printed circuit boards of electronic products must also be reduced in size. In the case of integrally formed micro-inductors, the structure is mainly formed by first forming internal circuits through winding, and after packaging and molding, terminal electrodes for external electrical connection are formed on the left and right sides. [0003] However, since the terminal electrodes of the existing integrally formed micro-inductors are located on the left and right sides of the component, such as Chinese patent CN201921231975.6, not only the overall size of the component cannot be effectively reduc...

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Problems solved by technology

[0003] However, since the terminal electrodes of the existing integrally formed micro-inductors are located on the left and right sides of the component, such as Chinese patent CN201921231975.6, not only the overall size of the component cannot be effectively reduced, but also the inductance is soldered to the external printed circuit board through the terminal electrodes. At the same time, it is also easy to reduce the accumulation of printed circuit boards due to the problem of solder creeping

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