Method for manufacturing inductance elements in batches

Abstract

The invention relates to a method for manufacturing inductance elements in batches. The method comprises the following steps: 1, stamping a conductive substrate to form a main circuit conductor layer;2, arranging a magnetic material with a preset thickness in the first mold, and enabling the plurality of main circuit conductor layers on the conductive substrate to respectively correspond to one mold cavity; 3, punching the main circuit conductor layer on the conductive substrate to enable the main circuit conductor layer to fall onto the magnetic material in the mold cavity in the first mold;4, arranging a magnetic material with a preset thickness on the main line conductor layer in the mold cavity; 5, assembling the second mold and the first mold, pressing the magnetic material, and obtaining a semi-finished product wrapped with the electrical enhancement layer; 6, coating the periphery of the semi-finished product with a coating layer; and 7, in the semi-finished product in the step 6, cutting to remove the coating layer and the electrical enhancement layer at the two ends and part of the lower end of the semi-finished product. The method is simple in manufacturing process, a plurality of inductance elements can be manufactured at a time, and the production efficiency is greatly improved.

Description

technical field [0001] The content of the present invention relates to a method for mass production of inductance elements. Background technique [0002] With the advancement of science and technology, semiconductor technology is becoming more and more sophisticated, and the appearance of various electronic products has gradually developed towards a thinner and shorter shape, and the precision of electronic products is also increasing. The resistors, capacitors or inductors installed in various electronic products The number of such components also increases. Therefore, how to reduce the size of components such as resistors, capacitors, or inductors, and effectively simplify the production process of each component, so as to improve the overall production efficiency has become an important issue. [0003] As far as each component is concerned, taking the integrally formed micro-inductor as an example, the structural process is mainly to form the internal circuit by winding ...

AI Technical Summary

Problems solved by technology

However, it is difficult to miniaturize the molding size of the integrally formed micro-inductor manufactured in this way, and the overall production efficiency is low.

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