A shock absorbing device for a multi-wire cutting machine

Abstract

The invention relates to the field of multi-wire cutting machine auxiliary devices, in particular to a multi-wire cutting machine shock absorber, which includes two symmetrically placed shock absorbing components, and the wire of the multi-wire cutting machine passes through the two shock absorbing components. There is also a feed workbench matched with the metal wire between the two shock absorbing components; the shock absorbing component includes side support plates, floor seats, telescopic cylinders, sliding sleeves, mounting bars, upper support rollers, lower support rollers and transverse support rollers. Longitudinal elastic support components. The invention has a novel structure, is convenient for control and adjustment, has a better combined damping and supporting effect on the metal wire, and reduces the probability of the metal wire jumping out of the guide wheel groove.

Description

technical field [0001] The invention relates to the field of auxiliary devices for multi-wire cutting machines, in particular to a damping device for multi-wire cutting machines. Background technique [0002] Multi-wire cutting is a new cutting method that brings abrasive materials into the semiconductor processing area for grinding through high-speed reciprocating motion of metal wires, and cuts hard and brittle materials such as semiconductors into hundreds of thin slices at a time. The CNC multi-wire cutting machine has gradually replaced the traditional inner circle cutting and has become the main method of silicon wafer cutting. However, when the metal wire is cut at high speed, due to the high vibration frequency and large amplitude of the metal wire, it is easy to make the metal wire from Jumping out of the groove of the guide wheel will cause the metal wires to rub against each other, resulting in wire breakage. Therefore, when the metal wire is cutting, a shock abso...

AI Technical Summary

Problems solved by technology

The CNC multi-wire cutting machine has gradually replaced the traditional inner circle cutting and has become the main method of silicon wafer cutting. However, when the metal wire is cut at high speed, due to the high vibration frequency and large amplitude of the metal wire, it is easy to make the metal wire from Jumping out of the groove of the guide wheel will cause the metal wires to rub against each other, resulting in wire breakage. Therefore, when the metal wire is cutting, the shock absorbing device for the metal wire is essential.

[0003] The existing shock absorbing device has a single and traditional structure, which is inconvenient to control and adjust, and cannot provide a better combined shock absorbing support for the metal wire, and only has one shock absorbing method of pressing or lifting the shock absorbing support, which cannot be freely selected , more limited

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