A kind of preparation method of memory alloy nano lamination ni/ti preform

A technology of nano lamination and memory alloy, which is applied in liquid cleaning methods, metal rolling, metal rolling, etc., can solve the problems of NiTi alloy ingot element pollution, small pass deformation, and low material plasticity. Achieve the effects of large residual stress, high shape memory temperature and high elastic modulus

Active Publication Date: 2021-02-26
NORTHEASTERN UNIV LIAONING +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problems of element pollution in the NiTi alloy ingot obtained by the traditional smelting method, large deformation resistance in the cold working process, small pass deformation, low material plasticity, and complicated process, the present invention provides a memory alloy nano-laminated Ni / Ti prefabricated The preparation method of the billet is to prepare the laminated Ni / Ti preform by using the three-stage cumulative rolling large plastic deformation technology, combined with the cold working method to refine the grains, increase the specific surface interface of titanium and nickel grains, and reduce the layer thickness. The distance between the layer and the layer, as the grain size decreases, the atomic activity is enhanced, and the titanium atoms and nickel atoms are fully reacted and diffused at a certain temperature and time, which promotes their rapid alloying

Method used

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  • A kind of preparation method of memory alloy nano lamination ni/ti preform

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Embodiment 1

[0027] Preparation of a layered Ni / Ti preform with an average layer thickness of 93.43nm. The total thickness of the composite material is 0.28mm, and its composition design is as follows: the atomic fraction of Ti accounts for 50.8%, and the atomic fraction of Ni accounts for 49.2%.

[0028] A method for preparing a memory alloy nano-laminated Ni / Ti preform of this embodiment, the specific steps are:

[0029] Step 1, material preparation:

[0030] Select Ti foil with a thickness of 50 μm, Ti foil with a thickness of 20 μm, and Ni foil with a thickness of 30 μm, and then cut the Ti foil and Ni foil into 35mm×55mm, and use a suitable size bag, and then put the bag, Ti The foil and Ni foil are soaked in acetone for 30 minutes, cleaned by ultrasonic vibration, and finally air-dried with a hair dryer to obtain a clean package, Ti foil, and Ni foil;

[0031] Step 2, encapsulation:

[0032] Ti foil and Ni foil are stacked alternately according to Ti / Ni / Ti / Ni... / Ti, and 37 layers ...

Embodiment 2

[0041] Preparation of a layered Ni / Ti preform with an average layer thickness of 44.49nm. The total thickness of the composite material is 0.28mm, and its composition design is as follows: the atomic fraction of Ti accounts for 50.8%, and the atomic fraction of Ni accounts for 49.2%.

[0042] A method for preparing a memory alloy nano-laminated Ni / Ti preform of this embodiment, the specific steps are:

[0043] Step 1, material preparation:

[0044] Select Ti foil with a thickness of 50 μm, Ti foil with a thickness of 20 μm, and Ni foil with a thickness of 30 μm, and then cut the Ti foil and Ni foil into 35mm×55mm, and use a suitable size bag, and then put the bag, Ti The foil and Ni foil are soaked in acetone for 30 minutes, cleaned by ultrasonic vibration, and finally air-dried with a hair dryer to obtain a clean package, Ti foil, and Ni foil:

[0045] Step 2, encapsulation:

[0046] Ti foil and Ni foil are stacked alternately according to Ti / Ni / Ti / Ni... / Ti, and 37 layers ...

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Abstract

A method for preparing a memory alloy nano-laminated Ni / Ti preform belongs to the technical field of functional composite materials. The preparation steps include: (1) material preparation, (2) packaging, (3) rolling; the present invention adopts room temperature accumulation Overlap rolling, combined with wrapping to limit and hinder deformation, is conducive to the coordinated deformation of Ni / Ti, and solves the problems that NiTi alloy is easy to introduce impurity elements in the traditional smelting process, resulting in poor material processing performance, large deformation resistance during cold processing, and small deformation in each pass. ; Since the three-stage cumulative rolling is carried out at room temperature, and the intermediate process has not been annealed, the residual stress of the Ni / Ti layered preform after the final composite is large, the activity between the Ni atom and the Ti atom interface is high, and the layered Ni / Ti preform has high hardness and high modulus of elasticity. The shorter the time required for Ni and Ti to react and diffuse to form a NiTi shape memory alloy at a certain temperature, the NiTi alloy grains can be refined to a certain extent, and a high-quality NiTi shape memory alloy can be obtained. The finer the grains, the more The stability of the phase transition temperature can be improved, and the austenitizing phase transition temperature will also increase slightly.

Description

technical field [0001] The invention belongs to the technical field of functional composite materials, in particular to a method for preparing a memory alloy nano-laminated Ni / Ti preform. Background technique [0002] NiTi shape memory alloy is a functional composite material, which is widely used in aerospace, biomedical, energy and chemical industries, etc. It not only has high specific strength, good wear resistance and corrosion resistance, high fatigue strength, but also has shape memory Effect (SME) and superelasticity (SE), as well as good biocompatibility and other advantages. At present, the commonly used method for preparing NiTi shape memory alloys is mainly to obtain NiTi alloy ingots by smelting, and then control the microstructure by subsequent hot or cold processing of the ingots, so that they have shape memory properties. However, the hot processing method in the prior art has harsh process conditions, and it is easy to cause surface and even internal oxidat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21B3/02B21B45/02B21B37/56B21B37/46B08B3/08B08B3/12F26B21/00B23K9/16
CPCB08B3/08B08B3/12B21B3/02B21B37/46B21B37/56B21B45/0272B23K9/16F26B21/00
Inventor 张进涛丁桦张宁曲海涛李殊霞侯红亮
Owner NORTHEASTERN UNIV LIAONING
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