Air-cooled laser emitting device

Abstract

The invention discloses an air-cooled laser emitting device. The device comprises a heat dissipation assembly, a semiconductor laser device, a fixing frame and an optical fiber interface arranged on the semiconductor laser device, wherein the fixing frame comprises four L-shaped components, and the top of each L-shaped component is provided with a bending piece used for buckling the semiconductorlaser device, the bottom of the L-shaped component is fixedly connected with the heat dissipation assembly, and the semiconductor laser device is buckled on the heat dissipation assembly through the bending piece, the heat dissipation assembly comprises a TEC semiconductor chilling plate, a heat dissipation base arranged on a bottom face of the TEC semiconductor chilling plate and a heat dissipation sheet fixed to a bottom surface of the heat dissipation base, the two L-shaped components in the same direction as the cooling fin are oppositely arranged, the bent ends of the two L-shaped components are opposite, the four L-shaped components are located at four corners of the semiconductor laser device respectively, and embedding grooves used for embedding the corners of the semiconductor laser device are formed in the L-shaped components. The device is advantaged in that the fixing effect of the semiconductor laser device can be improved while efficient heat dissipation is provided, andpositioning precision during laser use is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to an air-cooled laser emitting device. Background technique [0002] In the optoelectronic information industry, laser technology is an important technical field. With the development of technology, laser technology has spread to all parts of life. [0003] Most of the existing laser emitting devices on the market adopt water cooling to dissipate heat, such as the laser disclosed in the application number CN201110431448.5, so that they are bulky and inconvenient to carry. [0004] The air-cooled setting in the prior art is likely to cause vibration due to the rotation of the fan, which will weaken the fixing effect of the semiconductor laser, and will cause displacement deviation under the action of vibration, which will easily affect the positioning accuracy of the laser. Contents of the invention [0005] In view of the deficiencies in the prior art, the purpose o...

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Problems solved by technology

[0003] Most of the existing laser emitting devices on the market use water cooling to dissipate heat, such as the laser disclosed in the application number CN201110431448.5, so that it is bulky and inconvenient to carry

[0004] The air-cooled setting in the prior art is likely to cause vibration due to the rotation of the fan, which in turn weakens the fixing effect of the semiconductor laser, and a displacement deviation will occur under the action of vibration, which will easily affect the positioning accuracy of the laser.

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