Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Laminating false sticking machine for flexible printed circuit board

A technology of flexible printed circuit and film coating, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as uneven heating, achieve the effect of improving efficiency and avoiding damage

Active Publication Date: 2020-02-28
GUANGDONG ZECHENG TECHNOLOGY CO., LTD
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a flexible printed circuit board lamination fake paste machine, which has the advantage of fully heating the circuit board and solves the problem of uneven heating of the existing lamination

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laminating false sticking machine for flexible printed circuit board
  • Laminating false sticking machine for flexible printed circuit board
  • Laminating false sticking machine for flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] see Figure 1-4 , the present invention provides a technical solution: a flexible printed circuit board lamination fake sticker machine, including a first bottom plate 1, the four corners of the first bottom plate 1 are fixedly connected with first pistons 2, each first A telescopic spring 3 is placed inside the piston 2, the bottom end of each telescopic spring 3 is fixedly connected with the first bottom plate 1, and the top end of each telescopic spr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a laminating false sticking machine for a flexible printed circuit board and relates to the technical field of circuit board processing. The machine comprises a first bottom plate, wherein first pistons are fixedly connected with four corners of the first bottom plate correspondingly, a telescopic spring is arranged in each first piston, a bottom end of each telescopic spring is fixedly connected with the first bottom plate, a top end of each telescopic spring is fixedly connected with a first piston rod, a second bottom plate is arranged above the first bottom plate, and a top end of each first piston rod is fixedly connected with the second bottom plate. The laminating false sticking machine is advantaged in that the first bottom plate, a first piston and the telescopic spring are arranged, the second bottom plate can play a role in buffering when being pressed downwards, the circuit board can move along with the conveying belt by arranging a driving wheel, adriven wheel and the conveying belt, and the circuit board can be automatically pressed downwards to complete film covering by arranging a stand column, a transverse plate, an electric telescopic rodand an electric heating plate.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a flexible printed circuit board film-coated fake sticking machine. Background technique [0002] A circuit board is a structure used in many devices to integrate circuits and electronic components to save space. [0003] In the process of making circuit boards, dust falls to the surface of the circuit boards and uneven heating often occurs, thereby affecting the coating of the circuit boards. The circuit board laminating machine disclosed in the Chinese invention patent application publication specification CN208466731U The special sticky dust device clears the dust on the upper surface of the circuit board by using the sticky dust film. Contents of the invention [0004] The purpose of the present invention is to provide a flexible printed circuit board lamination false paste machine, which has the advantage of fully heating the circuit board and solves the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/26H05K3/28
CPCH05K3/26H05K3/281H05K2203/1377H05K2203/1105
Inventor 贺洪牛唐清平
Owner GUANGDONG ZECHENG TECHNOLOGY CO., LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com