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PCB patch spring structure and assembling mode

A PCB board and spring structure technology, which is applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, electrical components, etc., can solve the problem of affecting the overall quality of products, easily damaging PCB boards, and affecting work efficiency. and other issues to achieve the effect of improving product appearance, speeding up production efficiency and improving quality

Inactive Publication Date: 2020-03-06
江苏联群电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Assembling springs on PCB boards is a common process in the electronics manufacturing industry. Traditional PCB board assembly springs use springs with vertical pins. The specific process is: first punch a hole on the PCB board, and then manually Insert the vertical pins at the bottom of the spring into the holes opened on the PCB board, and finally fix the pins and the PCB board together by welding on the back of the PCB board; this assembly method has many defects: it requires a lot of labor, PCB drilling, spring installation, and final pin welding all require different operators to operate, and the entire assembly time is also very slow, which affects work efficiency; drilling holes on the PCB board is easy to damage the PCB board, causing unnecessary damage. Necessary loss; at the same time, there are errors in manual operation, which leads to an increase in the defect rate of the product during the assembly process, which affects the overall quality of the product

Method used

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  • PCB patch spring structure and assembling mode
  • PCB patch spring structure and assembling mode
  • PCB patch spring structure and assembling mode

Examples

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Effect test

Embodiment

[0035] Embodiment: A PCB board patch spring structure and assembly method:

[0036] The specific structure of the PCB patch spring is as follows: Figure 1~2 As shown, it includes PCB board 1, spring 2 and patch 4. The patch 4 is specifically a high-temperature resistant film, because the product needs to be heated at a high temperature in the end. In order not to damage the patch 4, a high-temperature resistant film is selected. The material of the film can be It can be replaced according to customer needs and different scenarios. Plastic and metal materials can be used, as long as the placement machine can recognize it; in addition, the spring 2 is made of high-temperature-resistant and solderable material, which is also to prevent the spring 2 from being deformed or damaged due to high-temperature heating. ; The surface of the PCB board 1 is provided with a spring installation area, the spring 2 is arranged on the spring installation area on the surface of the PCB board 1, ...

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PUM

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Abstract

The invention discloses a PCB patch spring structure and an assembling mode. The PCB patch spring structure comprises a PCB, a spring and a patch. A spring mounting area is arranged on the surface ofthe PCB; the spring is arranged in the spring mounting area on the surface of the PCB; a pin is arranged at the bottom of the spring, specifically the pins is a flat pin, the flat pin is flush with the bottom of the spring. A metal face corresponding to the flat pin is arranged on the surface of the PCB. When the spring is installed on the PCB, the flat pin is tightly attached to the metal face ofthe PCB, and the patchis attached to the top of the spring. According to the scheme, the vertical pin of a common plug-in spring is designed into the flat pin and combined with the high-temperature-resistant patch to form a patch spring finished product. A chip mounter is used for identifying the patch on the top of the spring, the spring is correspondingly and automatically placed on the PCB andthen the flat pin on the spring and the metal sace on the PCB are welded together through solder paste so that the whole spring assembling process of the PCB is fully automatic, efficient and rapid,and a large amount of manpower and material resources are saved.

Description

technical field [0001] The invention belongs to the technical field of PCB assembly springs, and in particular relates to a PCB patch spring structure and an assembly method. Background technique [0002] Assembling springs on PCB boards is a common process in the electronics manufacturing industry. Traditional PCB board assembly springs use springs with vertical pins. The specific process is: first punch a hole on the PCB board, and then manually Insert the vertical pins at the bottom of the spring into the holes opened on the PCB board, and finally fix the pins and the PCB board together by welding on the back of the PCB board; this assembly method has many defects: it requires a lot of labor, PCB drilling, spring installation, and final pin welding all require different operators to operate, and the entire assembly time is also very slow, which affects work efficiency; drilling holes on the PCB board is easy to damage the PCB board, causing unnecessary damage. Necessary ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/30
CPCH05K1/181H05K3/303
Inventor 卞当代
Owner 江苏联群电子科技有限公司
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