A substrate processing apparatus and a substrate processing method

A substrate processing device and a technology for substrates, which are applied to devices and coatings that apply liquid to surfaces.

Active Publication Date: 2020-03-10
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, the above-mentioned problem is the same in a substrate processing apparatus having a structure in which a nozzle unit having a nozzle that ejects a processing liquid from a slit-shaped discharge port comes into contact with an abnormal portion of the substrate due to an abnormality in the substrate. Structure

Method used

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  • A substrate processing apparatus and a substrate processing method
  • A substrate processing apparatus and a substrate processing method
  • A substrate processing apparatus and a substrate processing method

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Embodiment Construction

[0041] figure 1 It is a figure which schematically shows the whole structure of the coating apparatus which is one Embodiment of the substrate processing apparatus of this invention. in addition, figure 2 yes figure 1 Partial top view of coating apparatus shown. The coating device 1 is directed from figure 1 A slit coater that coats the upper surface Sf of the substrate S conveyed in a horizontal posture from the left side to the right side with a coating liquid. In addition, in the following figures, in order to clarify the arrangement relationship of each part of the device, the conveyance direction of the substrate S is taken as the "X direction", and the figure 1 The horizontal direction from the left side to the right side is called "+X direction", and the opposite direction is called "-X direction". In addition, the front side of the device in the horizontal direction Y perpendicular to the X direction is referred to as "-Y direction", and the rear side of the ...

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Abstract

The invention provides a substrate processing apparatus which has sufficient time and detects abnormal parts of a substrate such as foreign matters on the substrate or bumps on the surface of the substrate on the front side of a nozzle unit. The apparatus discharges a processing liquid from a nozzle and supplies the processing liquid to the substrate by relatively moving the nozzle unit having thenozzle with respect to the substrate, and an abnormality detection mechanism provided on a front side of the nozzle unit in a traveling direction orthogonal to a longitudinal direction of the nozzlehas a plurality of detection units. The plurality of detection units irradiate a laser beam between a light projector and a light receiver that are disposed facing each other in the longitudinal direction with an abnormality detection region therebetween, detect abnormalities in different effective detection ranges by the plurality of detection units, and are disposed such that a proximity laser beam among the plurality of laser beams obliquely intersects the travel direction. The proximity laser beam partially passes through a nozzle proximity region of the proximity nozzle unit, and an effective detection range of the proximity laser beam is closer to a front side in a traveling direction than the nozzle proximity region.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method for supplying a processing liquid to a substrate by relatively moving the nozzle with respect to the substrate while ejecting the processing liquid from the nozzle. Background technique [0002] As an example of a substrate processing apparatus that supplies a processing liquid to a substrate from a nozzle, a substrate processing apparatus described in Japanese Patent No. 4105613 is known. In this substrate processing apparatus, the nozzle is relatively moved with respect to the substrate in a state where the tip of the nozzle is brought close to the substrate, and the processing liquid is supplied to the surface of the substrate. Therefore, if the substrate processing is continued when there is an abnormality in which foreign matter adheres to the surface of the substrate or an abnormal state in which the substrate is raised due to foreign matter being ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C11/10
CPCB05C5/0254B05C11/1015
Inventor 西冈贤太郎
Owner DAINIPPON SCREEN MTG CO LTD
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