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Grinding device for chemical processing of materials

A chemical processing and abrasive technology, applied in the abrasive field, can solve the problems of low degree of automation, large particle raw materials are not easy to break and grind, and the grinding effect is poor.

Inactive Publication Date: 2020-03-17
东阳鸿松机械科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current abrasive devices for chemical processing of materials are not only low in automation and inconvenient to control, but also difficult to break and grind large-grained raw materials during grinding, and at the same time, the grinding efficiency is low and the grinding effect is poor.

Method used

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  • Grinding device for chemical processing of materials
  • Grinding device for chemical processing of materials
  • Grinding device for chemical processing of materials

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Experimental program
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Effect test

Embodiment Construction

[0018] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0019] Combine below Figure 1-4 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0020] An abrasive device for material chemical processing of the device of the present invention includes a base body 10 and a fixed block 57, the fixed block 57 is provided with a transmission groove 13 with an upward opening, and the base body 10 is provided with a crushing chamber 25 with an upward opening, A crushing mechanism 101 is provided in the crushing chamber 25, and a fine grinding chamber 30 communicated with it is provided below the crushing chamber 25, and a fine grinding mechanism 102 i...

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Abstract

The invention discloses a grinding device for chemical processing of materials. The grinding device comprises a base body and a fixing block, wherein the fixing block is internally provided with a transmission groove with an upward opening, the base body is internally provided with a crushing cavity with an upward opening, the crushing cavity is internally provided with a crushing mechanism, a fine grinding cavity communicating with the crushing cavity is formed under the crushing cavity, the fine grinding cavity is internally provided with a fine grinding mechanism, and storage mechanisms arearranged at the wall body positions, located at the left end and the right end, of the fine grinding cavity. A driven cavity communicating with the fine grinding cavity is formed in the left side ofthe fine grinding cavity, the driven cavity is internally provided with a driven mechanism, a driving cavity is formed below the driven cavity, the driving cavity is internally provided with a drivingmechanism, an aggregate cavity is formed in the right side of the driving cavity, the aggregate cavity is internally provided with an aggregate mechanism, a first rectangular groove is formed below the driving cavity, a second rectangular groove is formed in the left side of the first rectangular groove, and a first rotating shaft is rotatably installed between the second rectangular groove and the first rectangular groove.

Description

technical field [0001] The invention relates to the field of abrasive technology, in particular to an abrasive device for material chemical processing. Background technique [0002] Material processing occupies an important position in the machinery manufacturing industry and is the foundation of various industries in the manufacturing industry. In today's era of rapid development of computer and information technology industries, it still plays a leading role in the national economy. Material processing includes a wide range, mainly including liquid metal forming, metal plastic forming, welding, metal surface treatment, powder metallurgy forming, laser rapid prototyping, etc., and new processes are constantly emerging. The current abrasive devices for material chemical processing are not only low in automation and inconvenient to control, but also difficult to break and grind large-grained raw materials during grinding, and at the same time, the grinding efficiency is low a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B02C21/00B02C23/02
CPCB02C21/00B02C23/02
Inventor 朱合喜
Owner 东阳鸿松机械科技有限公司
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