Circuit board oil supplementing device

Abstract

The embodiment of the invention provides a circuit board oil supplementing device. The circuit board oil supplementing device comprises a vacuum cover covering a circuit board at the periphery of a target hole and an air extractor communicating with the vacuum cover, and also comprises an oil injection device which comprises an oil injection pipeline and a control device for controlling the on-offof the oil injection pipeline. The oil injection pipeline comprises an oil injection opening formed in the vacuum cover, and the oil injection opening faces the target hole. The vacuum cover covers the circuit board at the periphery of the target hole to be filled with oil, a sealing cavity communicated with the target hole is formed between the vacuum cover and the circuit board, and the air extractor extracts the air in the sealed cavity and correspondingly extracts the air in the target hole at the same time, so that the vacuum degree in the hole is reduced. When the oil is supplemented, the circuit board oil supplementing device is not blocked by the air in the hole any more, the oil can enter the target hole more easily and fills the target hole which is not filled fully, the circuitboard oil supplementing working efficiency is conducive to being improved, and the oil filling hole quality is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a circuit board oil replenishing device. Background technique [0002] With the development of Printed Circuit Board (PCB) technology and the evolution of product complexity, PCB boards have developed to the design and application of multilayer boards. For connection, there are via holes penetrating the board surface on the PCB, and the hole walls of the via holes are provided with conductive materials such as copper materials, etc., and the circuits on the unit boards of each layer are connected through the conductive materials on the via holes. [0003] Since the circuit board must go through the etching process in the production process, the metal material on the wall of the via hole is eroded and damaged by the etching solution. Therefore, the prior art is to fill the conductive hole with ink for plugging, so that An anti-corrosion material is for...

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a circuit board refueling device, which is used to solve the problem in the prior art that the PCB board is in contact with the atmosphere so that the hole contains air, and the gap between the ink inserted during manual refueling and the ink already present in the via hole is solved. Wrapped with air, the fluidity of the ink is poor, and it is difficult to completely fill the via hole due to the obstruction of the air

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