Low vacunm bonding method of polydimethylsiloxane chip
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- XIAMEN UNIV
- Publication Date
- 2004-03-24
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
(1) Technical field
[0001] The invention relates to a low-vacuum bonding method, in particular to a low-vacuum bonding method for polydimethylsiloxane chips. (2) Background technology
[0002] Microfluidic chip (microfluidic chip) has a broad application prospect in the fields of analysis system, biomedicine, chemistry and biochemistry. The traditional microfluidic chip follows the IC industrial technology, and mainly uses silicon and glass as materials; therefore, it must go through a series of processes such as mask making, photolithography, and microchannel etching. The manufacturing process is complex, the cycle is long, and the efficiency is high. It is relatively low, and the sidewalls of microfluidic channels etched on such hard materials are difficult to be both smooth and steep. However, using high molecular polymers as materials to make microfluidic chips can overcome the above difficulties, thereby realizing low-cost, high-volume, and high-efficiency manufacturin...