Low vacunm bonding method of polydimethylsiloxane chip

A polydimethylsiloxane, low-vacuum technology, applied in biochemical equipment and methods, material inspection products, instruments, etc., can solve the problems of high chip temperature, easy damage to the chemical composition of the chip surface, and impact on chip performance, etc. To achieve the effect of simple equipment

Inactive Publication Date: 2004-03-24
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the overall requirements for equipment are relatively high, and it is difficult for general laboratories to achieve
Moreover, the general oxygen plasma treatment

Method used

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  • Low vacunm bonding method of polydimethylsiloxane chip
  • Low vacunm bonding method of polydimethylsiloxane chip
  • Low vacunm bonding method of polydimethylsiloxane chip

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1:

[0027] Pour the silicone rubber material into the chip mold, freshly peel off after polymerization to obtain the PDMS chip assembly, put it into the vacuum chamber, and evacuate until the background vacuum of the cavity is 0.2 Torr; flush with oxygen for 3 times to exhaust the residual gas, Turn off the oxygen flow, then vacuum (ie oxygen pressure) to 0.3 Torr, and add high pressure 1400V (current 220mA) to start the oxygen in the cavity and bombard the surface of the PDMS chip with oxygen plasma for 40s; open the gas release valve , Inflate the vacuum chamber to equilibrium with the atmospheric pressure, then open the vacuum chamber, attach the chip, and keep it at 100°C for 2 hours to achieve irreversible bonding.

[0028] After oxygen plasma treatment, the surface of the PDMS chip has strong hydrophilicity, and its contact angle is close to 0°, but the hydrophilicity gradually deteriorates with time, and it almost returns to the untreated state after about 3...

Example Embodiment

[0032] Example 2:

[0033]Pour the silicone rubber material into the chip mold, freshly peel off after polymerization, to obtain the PDMS chip assembly, put it into the vacuum chamber, and vacuum until the background vacuum of the cavity is 0.15 Torr; repeatedly flush with oxygen 2 times to exhaust the residual gas, Turn off the oxygen flow, then vacuum (ie oxygen pressure) to 0.25 Torr, and add a high voltage of 2000V (current 380mA) to start the oxygen in the cavity and bombard the surface of the PDMS chip with oxygen plasma for 5 seconds; open the gas release valve , Inflate the vacuum chamber to equilibrium with the atmospheric pressure, then open the vacuum chamber, attach the chip, and keep it at 120°C for 1.5 hours to achieve irreversible bonding.

[0034] After the oxygen plasma treatment, the surface of the PDMS chip has strong hydrophilicity, and its contact angle is close to 0°, but the hydrophilicity gradually deteriorates with time, and it almost returns to the untre...

Example

[0035] Examples 3-10:

[0036] Example

[0037] Experiments show that the hydrophilicity of PDMS chips treated with oxygen plasma is greatly improved, and water droplets can quickly spread on the surface of PDMS (contact angle is close to 0°)

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Abstract

The invention refers to a low-vacuum bonding method for a polydimethylsiloxane chip, its steps: freshly peel off the polymerized silicon latex sample to obtain chip subassembly, place in vacuum cavity, vacuumize, wash by oxygen again and again, and eliminate the remnant gas; vacuumize again, exert high pressure to make the oxygen light up in the vacuum cavity, to make oxygen plasm bombardment on the chip subassembly's surface, the air pressure equal to the atmospheric pressure, open the vacuum cavity, and joint the chip subassembly. It has very high bonding intensity, able to surpass that of PDMS noumenon.

Description

(1) Technical field [0001] The invention relates to a low-vacuum bonding method, in particular to a low-vacuum bonding method for polydimethylsiloxane chips. (2) Background technology [0002] Microfluidic chip (microfluidic chip) has a broad application prospect in the fields of analysis system, biomedicine, chemistry and biochemistry. The traditional microfluidic chip follows the IC industrial technology, and mainly uses silicon and glass as materials; therefore, it must go through a series of processes such as mask making, photolithography, and microchannel etching. The manufacturing process is complex, the cycle is long, and the efficiency is high. It is relatively low, and the sidewalls of microfluidic channels etched on such hard materials are difficult to be both smooth and steep. However, using high molecular polymers as materials to make microfluidic chips can overcome the above difficulties, thereby realizing low-cost, high-volume, and high-efficiency manufacturin...

Claims

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Application Information

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IPC IPC(8): C12Q1/68G01N27/26G01N27/416G01N33/68G01N35/00
Inventor 沈德新周勇亮罗仲梓
Owner XIAMEN UNIV
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