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Cooling device for at least one component mounted on printed circuit board and printed circuit board

A technology for printed circuit boards and cooling devices, which is applied in the directions of printed circuit components, printed circuits, printed circuits, etc., can solve problems such as increasing the installation workload.

Pending Publication Date: 2020-03-17
デュルコップアドラーアクチエンゲゼルシャフト
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This cooling technique usually requires increased installation effort

Method used

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  • Cooling device for at least one component mounted on printed circuit board and printed circuit board
  • Cooling device for at least one component mounted on printed circuit board and printed circuit board
  • Cooling device for at least one component mounted on printed circuit board and printed circuit board

Examples

Experimental program
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Effect test

Embodiment Construction

[0029] figure 1 A printed circuit board 2 equipped with various SMD components 1 and a metal housing 3 for receiving the printed circuit board 2 are shown in an exploded view. exist figure 1 , the components of the cooling device collectively designated 5 are arranged between the printed circuit board 2 and the bottom housing wall 4 of the metal housing 3 . The cooling device 5 serves to cool at least one of the components 1 mounted on the printed circuit board 2 . The cooling device 5 , as a heat conducting element frame, has a plastic heat sink frame 6 which includes four heat sink receptacles 7 as heat conducting element receptacles. The plastic material of the heat sink frame 6 is fireproof, electrically insulating, heat-resistant and shape-fixed.

[0030] The heat sink receptacle 7 is arranged complementary to the cuboid metal heat sink 8, one of which is in the figure 1 shown in . The metal cooling body 8 serves as a heat conducting element. The metal heat sink 8 c...

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PUM

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Abstract

A cooling device for at least one component mounted on a printed circuit board and the printed circuit board are disclosed. The cooling device has at least one heat-conducting element and a plastic heat-conducting element holder (6) with at least one heat-conducting element receptacle (7). The at least one heat-conducting element is arranged in the at least one heat-conducting element receptacle.When the cooling device is mounted, an electrically insulating printed circuit board heat-conducting layer (9) covers the heat-conducting element holder (6) towards the printed circuit board and is indirect heat-conducting connection with the heat-conducting element. The cooling device can satisfy the demanding thermal requirements for components to be cooled.

Description

[0001] Cross References to Related Applications [0002] The content of German patent application DE 10 2018 215 338.8 is hereby incorporated by reference. technical field [0003] The invention relates to a cooling device for at least one component mounted on a printed circuit board. Furthermore, the invention relates to a printed circuit board equipped with a component comprising such a cooling device. Background technique [0004] Cooling devices for printed circuit board components are referred to as heat sinks, the surface of which is enlarged by, for example, rib structures. Such heat sinks are used in printed circuit board housings. The use of housings for printed circuit boards as heat sinks is also known, wherein components are connected to the heat sink, involving additional installation and insulation effort, for example by means of clamping or screwing. This cooling technique usually requires increased installation effort. [0005] JP 2004 006 791 A discloses...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K1/02
CPCH05K7/205H05K1/0209H05K7/20445H05K1/0206H05K2201/066
Inventor 斯温·菲佛亚历山大·邦格斯费利克斯·利伯鲁姆莫里斯·哈鲍姆
Owner デュルコップアドラーアクチエンゲゼルシャフト
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