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Thin plate turnover device and using method thereof

A thin plate and partition technology, used in transportation and packaging, conveyors, conveyor objects, etc., can solve problems such as increasing the workload of workers, achieve good applicability and practicability, improve the scope of application, and turn over efficiency. Effect

Inactive Publication Date: 2020-03-24
东莞市鸿仁自动化设备科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above exposure procedure, the exposure machine can only expose one surface of the PCB board at a time, so for the PCB board that only needs one-sided exposure, there is no problem in the operation, but sometimes it needs two-sided exposure. PCB board, so that after the exposure of one side is completed during operation, it needs to be manually turned over and then exposed again, especially when the output is large, which greatly increases the workload of workers

Method used

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  • Thin plate turnover device and using method thereof
  • Thin plate turnover device and using method thereof
  • Thin plate turnover device and using method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Example 1: A thin plate turning device, such as figure 1 As shown, it includes a working table 2, a positioning table 3, and a robot arm 1. The working table 2 includes a first table body 21 and a second table body 22 placed vertically, and a thin plate 14 is formed on the surface of the first table body 21. The first temporary storage area 221, the second temporary storage area 221 is formed on the second platform 22, the first space 23 and the second space 24 are formed on the sides of the first platform 21 and the second platform 22, and the mechanical The arm 1 and the positioning table 3 are both installed and fixed in the first space 23; among them, the robotic arm 1 is a six-degree-of-freedom manipulator that can grab any object in the space; the positioning table 3 is rotatably connected with a turntable 31. In this embodiment, the positioning table 3 Vertical arrangement, the turntable 31 rotates on a horizontal plane, and a driving member for driving the turntab...

Embodiment 2

[0047] Embodiment 2: A thin plate turning device, such as Figure 5 As shown, the difference from Embodiment 1 is mainly in the position where the positioning table 3 is set. In this embodiment, the positioning table 3 is fixedly arranged in the second space 24, and the positioning table 3 is arranged horizontally, that is, the turntable 31 and the second The positioning member rotates on a vertical plane; in this way, the initial position of the suction plate 4 on the positioning table 3 is horizontal during the specific use process, and the suction head 7 on the suction plate 4 is set upwards. At this time, the suction plate on the positioning table 3 4 is parallel to the thin plate 14 placed at the first temporary storage area 221, and then the robotic arm 1 can directly place the thin plate 14 on the suction plate 4 of the positioning table 3 after lifting it, and then use the suction plate 4 on the turntable 31 During the completion of the adsorption and fixation, the rotat...

Embodiment 3

[0048] Embodiment 3: A thin plate turning device, such as Image 6 As shown, the difference from Embodiment 1 is mainly in the structure of the second positioning member. In this embodiment, the second positioning member includes partitions 8 arranged at intervals. The bottom of the partitions 8 is fixed on the top surface of the turntable 31. Between the plates 8 is formed a slot 9 into which the thin plate 14 is inserted. The width of the slot 9 is equal to the thickness of the thin plate 14. At the same time, the thin plate 14 is provided with a through slot 5 penetrating in a strip shape. The thin plate 14 forms an entrance and exit 10, and the entrance and exit 10 are used for the insertion and removal of the thin plate 14. The through groove 5 is used for the passage of the adsorption head 7 on the robot arm 1, so that the adsorption head 7 on the robot arm 1 can be fixed to the surface of the thin plate 14 ; In this way, the thin plate 14 can be inserted into the slot 9 d...

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PUM

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Abstract

The invention discloses a thin plate turnover device and a using method thereof. The device comprises a workbench and further comprises a positioning table and a mechanical arm for carrying a thin plate, and a first temporary storage area and a second temporary storage area are formed. A rotary table is rotatably arranged on the positioning table. A first positioning piece for fixing the thin plates is arranged on the mechanical arm, and a second positioning piece for fixing the thin plate is arranged on the rotary table; in this way, the thin plate with the exposed upper surface is placed inthe first temporary storage area; after the first positioning piece on the mechanical arm is fixed to the upper surface of the thin plate, and the thin plate is carried to the rotary table to make thelower surface of the thin plate fixed to the second positioning piece, the thin plate is loosened by first positioning piece, and the driving part drives the thin plate to rotate until the lower surface of the thin plate faces the first positioning part; after the first positioning part and the lower surface of the thin plate are fixed, the second positioning part loosen the thin plate, and the thin plate is carried to the second temporary storage area through the mechanical arm, and the lower surface of the sheet faces upwards at the moment, so that thin plate turnover operation is automatically achieved, workload of workers is effectively reduced, and turnover efficiency is improved.

Description

Technical field [0001] The invention relates to the field of circuit board production equipment, and more specifically, it relates to a thin plate turning device and a use method thereof. Background technique [0002] In the manufacturing process of the printed circuit board, before the substrate is exposed, a photoresist layer and a film adhered to the surface of the photoresist layer are formed on the upper and lower surfaces of the substrate, and the upper and lower surfaces of the PCB are exposed on the exposure machine. After that, the film is peeled off to expose the photoresist layer to facilitate subsequent development and etching processes. In the above exposure procedure, the exposure machine can only expose one surface of the PCB board at a time, so that there is no problem in the operation for the PCB board that only needs to be exposed on one side, but sometimes it will be exposed to both sides. PCB board, after the exposure of one side is completed during the opera...

Claims

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Application Information

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IPC IPC(8): B65G47/248B65G47/91
CPCB65G47/248B65G47/914B65G2201/022
Inventor 高亚松
Owner 东莞市鸿仁自动化设备科技有限公司