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Image sensor with multi-integrated circuit buffer, imaging method and multi-integrated circuit imaging device

An image sensor and integrated circuit technology, applied in the field of image sensors, can solve problems such as sensitivity differences

Active Publication Date: 2021-09-28
OMNIVISION TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such pixel arrays may have sensitivity differences between pixels with different color filters due to wavelength-dependent attenuation in the silicon between the pixels and the second or backside of the integrated array

Method used

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  • Image sensor with multi-integrated circuit buffer, imaging method and multi-integrated circuit imaging device
  • Image sensor with multi-integrated circuit buffer, imaging method and multi-integrated circuit imaging device
  • Image sensor with multi-integrated circuit buffer, imaging method and multi-integrated circuit imaging device

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Experimental program
Comparison scheme
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Embodiment Construction

[0018] pixel embodiment

[0019] The triple sandwich image sensor 100 has a backside illuminated (BSI) pixel die 101 . The BSI die may have a color filter layer including various types of color filters 102 , 104 . If present, the color filter layer sits on top of an opaque blackout mask 106 that prevents stray light from affecting the non-pixel circuitry of the BSI pixel die. A light blocking mask 106 and color filters 102 , 104 are deposited on the backside of a thinned silicon substrate 108 . Pixels are formed within the substrate 108, which may all be of the same type, or of multiple types 110, 112 in other embodiments. Pixels 110 , 112 are located beneath openings 114 in light shielding mask 106 . Also formed within the substrate 108 are transistors, such as pixel select transistors, having source and drain regions 116 .

[0020] On the front side of the BSI pixel die 101, gate regions (not shown) associated with the pixels 110, 112 and transistor source and drain regi...

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PUM

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Abstract

A multi-IC buffered image sensor has a first IC having a pixel, a select transistor, and an interconnect coupling the selected pixel to a first inter-die bond pad, the first inter-die bond pad The pads carry the image data to a second IC with logic and ADC. The ADC has an input coupled to the selected pixel, and an output of the through-silicon via and inter-die bond pad to a third IC coupled to buffer the raw image data in the DRAM. One method includes: capturing an image using an array pixel IC divided into sub-arrays, each of which is coupled to a separate, associated ADC via an inter-die bond; scanning the sub-arrays and converting the image data to digital image data; and transferring the digital image data to a buffer in the DRAM via inter-die bonding.

Description

technical field [0001] The present disclosure relates to an image sensor having a separate stacked pixel array, dynamic random access memory (DRAM), and logic / analog-to-digital converter integrated circuit die. Background technique [0002] Image sensor arrays, such as those used in modern cameras and camera phones, have a large number of pixels, each pixel typically including a photodiode. For example, a 4160x3328 image sensor has 13.8x megapixels, and high-end cameras may have many more pixels. When each pixel is read by an analog-to-digital converter (ADC), typically at least 8 bits of data are produced per pixel, using ADCs known in the art to produce 10, 12 or even 16 bits. A 4160×3328 array with a 16-bit ADC can generate up to 221 Mbits of raw data for a single image. What is needed in the market today are cameras capable of capturing multiple high-resolution images sequentially. Digital cameras that capture bursts of high-resolution images can capture large amounts...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/378H04N9/04
CPCH04N25/772H01L27/14621H01L27/14623H01L27/14634H01L27/14636H01L27/1464H01L27/14645H04N25/79H04N25/771
Inventor 丁台衡柳勋杨征尹贤洙陈家明
Owner OMNIVISION TECH INC