Multi-group hot pressing head device capable of being independently adjusted

Abstract

The invention discloses a multi-group hot pressing head device capable of being independently adjusted. The multi-group hot pressing head device comprises a frame, a guide rail installed on the frame,a plurality of lifting devices connected with the guide rail in a sliding mode, a plurality of horizontal adjusting mechanisms installed below the lifting devices and a plurality of hot pressing heads installed below the horizontal adjusting mechanisms. The hot-pressing heads are arranged at intervals in the length direction of the guide rail and can be adjusted in position, the horizontal adjusting mechanism can adjust the levelness of the hot-pressing heads, and the lifting device can drive the hot-pressing heads to ascend and descend. According to the invention, multiple groups of hot-pressing head units are adopted, the distance and the position of the hot-pressing head can be independently adjusted; the horizontal adjusting mechanism is adopted at the same time, so that the levelnessof the hot-pressing head is not easy to change, and the horizontal adjusting mechanism is simple in structure and is beneficial for an operator to adjust the levelness of the hot-pressing head more simply and quickly, thereby improving the binding stability and the binding quality.

Description

technical field [0001] The invention relates to the field of FPC binding equipment, in particular to a multi-group independently adjustable thermal pressure head device. Background technique [0002] FPC (Flexible Printed Circuit, flexible circuit board) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, referred to as soft board, with wiring Due to the characteristics of high density, light weight, and thin thickness, in the traditional touch screen production method, it is often necessary to bind multiple FPCs to a PCB. The implementation method in the prior art is to crimp the FPCs with a long thermal head to the PCB, but there are many disadvantages in this operation method. For example, compared with the ordinary thermal head, the long thermal pressure head is prone to long thermal pressure during use due to factors such as the material and temperature of the thermal pressure head. The levelness of the head is easy to...

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Problems solved by technology

[0002] FPC (Flexible Printed Circuit, flexible circuit board) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, referred to as soft board, with wiring Due to the characteristics of high density, light weight, and thin thickness, in the traditional touch screen production method, it is often necessary to bind multiple FPCs to a PCB. The implementation method in the prior art is to crimp the FPCs with a long thermal head to the PCB, but there are many disadvantages in this operation method. For example, compared with the ordinary thermal head, the long thermal pressure head is prone to long thermal pressure during use due to factors such as the material and temperature of the thermal pressure head. The levelness of the head is easy to change, which directly affects the binding quality in the end, and because the long heat head is relatively long, it is difficult for the operator to adjust the levelness, and it takes a long time, and the cost of replacing the long heat head It is also relatively high, and the replacement time is long

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