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Wafer Polishing Method

A technology of wafers and polishing discs, which is applied in the field of storage device production, can solve problems such as data loss, storage chip data errors, and affecting data stability, so as to achieve stable data storage, improve product yield, and ensure product quality.

Active Publication Date: 2021-06-29
BIWIN STORAGE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Migration of copper ions will cause data errors inside the memory chip, causing data loss and affecting data stability

Method used

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  • Wafer Polishing Method

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Embodiment 1

[0018] Please refer to figure 1 , Embodiment 1 of the present invention is:

[0019] A wafer polishing method, comprising the following processing steps:

[0020] S1. Perform rough grinding and fine grinding on the wafer to be processed in sequence.

[0021] Specifically, the wafer to be processed is placed on a grinding device, and different types of grinding wheels are used to perform rough grinding and fine grinding on the wafer. The type of grinding wheel used for coarse grinding is TD600VP3-3W-7X-300, and the type of grinding wheel used for fine grinding is TD8KVTSS-4W-7L-300. Both coarse grinding and fine grinding require grinding to a target thickness of 30ˉ60μm.

[0022] S2. Perform the first polishing treatment on the wafer to be processed.

[0023] In this embodiment, a wet polishing process is used to perform the first polishing treatment on the wafer to be processed, and a polishing liquid is required in the wet polishing process. The polishing liquid used in ...

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Abstract

The invention provides a wafer polishing method, which comprises performing the first polishing treatment on the wafer to be treated; then grinding the polishing surface of the polishing disk after the first polishing treatment to make the surface of the polishing surface rough; The polished surface of the optical disc is subjected to a second polishing process on the wafer to be processed. The present invention grinds the polishing disc after the first polishing treatment to make its surface have a certain roughness, and then uses the polished polishing disc to carry out the second polishing treatment on the wafer to be treated, so that the surface of the wafer can be polished The formation of micro-rough grinding marks overcomes the technical problem of copper ion pollution in the prior art, and achieves the technology of ensuring the original polishing function, reducing copper ion pollution, improving product yield, ensuring product quality, and achieving stable data storage. Effect.

Description

technical field [0001] The invention relates to the technical field of storage device production, in particular to a wafer polishing method. Background technique [0002] The traditional wafer polishing method requires the wafer to be rough-grinded, fine-grinded, and polished in sequence before it can be used for the production of storage devices, in which polishing liquid and polishing sheets are used during the polishing process. [0003] In the actual production process, if the wafer is too thin, the memory device produced will have the problem of data loss. This is because the surface of the wafer is polished too smooth by the traditional polishing method, and cations are easy to transition from the outside of the wafer to the wafer. In the industry, this situation is called copper ion pollution. Copper ions (Cu + ) at 200ˉ300°C has a penetration rate of 0.55 μm / sec. After the wafer is polished, the copper ion penetration rate will be faster than that in the non-polish...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00
CPCB24B1/00
Inventor 李振华刘会红
Owner BIWIN STORAGE TECH CO LTD
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