Puncture-resistant BOPET film for aluminizing and preparation method thereof
A puncture-resistant, thin film technology, applied in the field of plastic film manufacturing, to achieve excellent performance, reduce production costs, and wide application prospects
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Embodiment 1
[0024] A puncture-resistant BOPET film for aluminum plating, which consists of an upper surface layer, a core layer and a lower surface layer; in terms of mass percentage, the core layer is made of the following raw materials: 80% PET polyester chips, ENBA copolymerized modified PET polyester 20% slices, the upper surface layer is made of the following raw materials: 5% PET polyester chips, 10% ENBA copolymerized modified PET polyester chips, 85% PET polyester anti-adhesive masterbatch, and the lower surface layer is made of the following raw materials: 30% of PET polyester chips, 70% of PET polyester anti-adhesive masterbatch.
[0025] ENBA copolymerized modified PET polyester chips are made of the following raw materials in terms of mass percentage: ENBA 10%, PET chips 90%.
[0026] Wherein, the thickness of the upper surface layer accounts for 8.3%-9.0% of the total film thickness, and the thickness of the lower surface layer accounts for 8.3%-9.0% of the total film thickne...
Embodiment 2
[0035] A puncture-resistant BOPET film for aluminum plating, which consists of an upper surface layer, a core layer and a lower surface layer; in terms of mass percentage, the core layer is made of the following raw materials: 70% PET polyester chips, ENBA copolymerized modified PET polyester 30% slices; the upper surface layer is made of the following raw materials: 10% PET polyester chips, 15% ENBA copolymerized modified PET polyester chips, 75% PET polyester anti-adhesive masterbatch; the lower surface layer is made of the following raw materials: 32% of PET polyester chips, 68% of PET polyester anti-adhesive masterbatch.
[0036] ENBA copolymerized modified PET polyester chips are made of the following raw materials in terms of mass percentage: ENBA 20%, PET chips 80%.
[0037] Wherein, the thickness of the upper surface layer accounts for 9.0%-9.5% of the total film thickness, and the thickness of the lower surface layer accounts for 8.3%-9.0% of the total film thickness....
Embodiment 3
[0046]A puncture-resistant BOPET film for aluminum plating, which consists of an upper surface layer, a core layer and a lower surface layer; in terms of mass percentage, the core layer is made of the following raw materials: PET polyester chip 60%, ENBA copolymerized modified PET polyester 40% slices; the upper surface layer is made of the following raw materials: PET polyester chips 10%, ENBA copolymerized modified PET polyester chips 20%, PET polyester anti-adhesive masterbatch 70%; the lower surface layer is made of the following raw materials: 35% of PET polyester chips, 65% of PET polyester anti-adhesive masterbatch.
[0047] ENBA copolymerized modified PET polyester chips are made of the following raw materials in terms of mass percentage: ENBA 30%, PET chips 70%.
[0048] Wherein, the thickness of the upper surface layer accounts for 9.5%-10.0% of the total film thickness, and the thickness of the lower surface layer accounts for 8.3%-9.0% of the total film thickness. ...
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