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Conductive film, display module and electronic equipment

A technology of conductive adhesive film and conductive particles, used in conductive adhesives, adhesives, metal/alloy conductors, etc., can solve the problems of poor conductive performance of conductive adhesive films, and achieve the effect of improving conductive performance

Active Publication Date: 2022-04-22
VIVO MOBILE COMM CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0005] The invention discloses a conductive adhesive film, a display module and electronic equipment to solve the problem of poor conductivity of the conductive adhesive film

Method used

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  • Conductive film, display module and electronic equipment
  • Conductive film, display module and electronic equipment
  • Conductive film, display module and electronic equipment

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Embodiment Construction

[0020] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] Such as Figure 1-Figure 4 As shown, the embodiment of the present invention discloses a conductive adhesive film, the conductive adhesive film may specifically be anisotropic conductive...

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Abstract

The invention discloses a conductive adhesive film, a display module and electronic equipment. The conductive adhesive film includes a base layer and conductive particles, the base layer wraps the conductive particles, and the conductive particles include a conductive layer, a buffer layer and limiting particles. The conductive layer wraps the buffer layer, the buffer layer wraps the limiting particles, and the hardness of the limiting particles is greater than that of the buffer layer. When implementing the binding process, the conductive adhesive film is under pressure, and the limiting particles can limit the pressure degree of the conductive adhesive film, thereby preventing the conductive adhesive film from being over-pressed, thereby controlling the rebound force generated by the conductive particles, so that the conductive adhesive film It is not easy to peel off from the connected parts, thereby improving the conductivity of the conductive adhesive film.

Description

technical field [0001] The invention relates to the technical field of conductive structures, in particular to a conductive adhesive film, a display module and electronic equipment. Background technique [0002] With the advancement of technology and the development of electronic equipment, electronic equipment such as smartphones and tablet computers have become indispensable products in people's lives. [0003] Existing electronic equipment includes components that need to be electrically connected. For example, in a display module, a driver chip needs to be electrically connected to the lower glass plate of the display screen, so as to realize the driving of the display screen. Specifically, the driver chip can be connected to the lower glass plate using a COG (Chip On Glass) bonding process. At this time, a conductive adhesive film is provided between the driver chip and the lower glass plate, and the conductive adhesive film can realize the connection between the driver...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/10C09J9/02H01B1/02G09F9/00
CPCC09J7/10C09J9/02H01B1/02G09F9/00C09J2301/314
Inventor 黄治斌
Owner VIVO MOBILE COMM CO LTD
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