Conductive film, display module and electronic equipment

A technology of conductive adhesive film and conductive particles, used in conductive adhesives, adhesives, metal/alloy conductors, etc., can solve the problems of poor conductive performance of conductive adhesive films, and achieve the effect of improving conductive performance
CN110938382BActive Publication Date: 2022-04-22VIVO MOBILE COMM CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
VIVO MOBILE COMM CO LTD
Publication Date
2022-04-22

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Abstract

The invention discloses a conductive adhesive film, a display module and electronic equipment. The conductive adhesive film includes a base layer and conductive particles, the base layer wraps the conductive particles, and the conductive particles include a conductive layer, a buffer layer and limiting particles. The conductive layer wraps the buffer layer, the buffer layer wraps the limiting particles, and the hardness of the limiting particles is greater than that of the buffer layer. When implementing the binding process, the conductive adhesive film is under pressure, and the limiting particles can limit the pressure degree of the conductive adhesive film, thereby preventing the conductive adhesive film from being over-pressed, thereby controlling the rebound force generated by the conductive particles, so that the conductive adhesive film It is not easy to peel off from the connected parts, thereby improving the conductivity of the conductive adhesive film.
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Description

technical field

[0001] The invention relates to the technical field of conductive structures, in particular to a conductive adhesive film, a display module and electronic equipment. Background technique

[0002] With the advancement of technology and the development of electronic equipment, electronic equipment such as smartphones and tablet computers have become indispensable products in people's lives.

[0003] Existing electronic equipment includes components that need to be electrically connected. For example, in a display module, a driver chip needs to be electrically connected to the lower glass plate of the display screen, so as to realize the driving of the display screen. Specifically, the driver chip can be connected to the lower glass plate using a COG (Chip On Glass) bonding process. At this time, a conductive adhesive film is provided between the driver chip and the lower glass plate, and the conductive adhesive film can realize the connection between the driver...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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