Packaging device and packaging method
A technology for packaging devices and packaging methods, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of poor heat dissipation of packaged devices, and achieve the effect of improving heat dissipation and high thermal conductivity
Pending Publication Date: 2020-03-31
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
View PDF0 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] Embodiments of the present invention provide a packaging device and a packaging method, aiming to solve the problem of poor heat dissipation of current packaging devices
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0065] In order to enable those skilled in the art to better understand this solution, the technical solution in this solution embodiment will be clearly described below in conjunction with the accompanying drawings in this solution embodiment. Obviously, the described embodiment is a part of this solution Examples, but not all examples. Based on the embodiments in this solution, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of this solution.
[0066] The term "comprising" and any other variants in the description and claims of this solution and the above drawings mean "including but not limited to", and are intended to cover non-exclusive inclusion. In addition, the terms "first" and "second", etc. are used to distinguish different objects, not to describe a specific order.
[0067] The realization of the present invention is described in detail below in conjunction with specific accompa...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| height | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a packaging device and a packaging method, and the packaging device comprises a packaging housing which employs a ceramic substrate as a packaging bottom plate, wherein the ceramic substrate is provided with a through hole passing through the front surface of the ceramic substrate and the back surface of the ceramic substrate, the interior of the through hole of the ceramicsubstrate is filled with metal, and the metal in the through hole is marked as a metal column; a chip which is installed in the packaging shell, wherien a bonding pad of the chip is connected with the metal column on the ceramic substrate through a bonding wire; and copper heat conduction columns which are arranged on the back surface of the ceramic substrate, wherein at least a preset number ofcopper heat conduction columns are used as input and output pins of the packaging device to be connected with the metal columns. The copper heat conduction columns are arranged on the back face of theceramic substrate, the copper heat conduction columns connected with the metal columns are arranged, the copper heat conduction columns serve as input and output pins of the packaging device, the heat conductivity is higher than that of a traditional surface-mounted bonding pad or solder ball, and the heat dissipation capacity of the packaging device is improved.
Description
technical field [0001] The invention relates to the technical field of chip packaging, in particular to a packaging device and a packaging method. Background technique [0002] Ceramic packaging is a commonly used RF chip packaging method. In order to reduce the thermal resistance of the package, the ceramic package is generally mounted on the PCB mother board in a QFN (Quad Flat No-lead Package) surface mount method. There is a large thermal mismatch between the ceramic package and the PCB mounting mother board, and the heat dissipation of the device needs to be considered during installation. [0003] The existing heat dissipation methods are mainly divided into two types. For small-sized surface-mount ceramic packages, in order to prevent package cracking caused by thermal stress, the package size is controlled to be less than 10*10mm. For larger-sized surface-mount ceramic packages, it is generally used to weld metal buffer gaskets at high temperature on the bottom of ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/498H01L23/15
CPCH01L23/15H01L23/49568H01L23/49827H01L23/49838H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 李仕俊赵瑞华常青松徐达杨阳阳王志会霍现荣冯涛高长征马海阔王会从
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP