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Ceramic pressure sensor packaging structure

A pressure sensor and packaging structure technology, applied in the field of sensors, can solve problems such as complex packaging structure, and achieve the effects of simple disassembly operation, improved work efficiency, and convenient fixation

Active Publication Date: 2020-04-10
无锡至鑫微科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic pressure sensor packaging structure to solve the problem that the existing ceramic pressure sensor packaging structure is relatively complex and the packaging structure is convenient for disassembly and maintenance.

Method used

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referre...

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Abstract

The invention belongs to the technical field of sensors and specifically relates to a ceramic pressure sensor packaging structure. The structure comprises an upper shell and a lower shell; a cavity isformed between the upper shell and the lower shell; a first sealing block and a second sealing block are arranged at the two ends of the upper shell and the two ends of the lower shell correspondingly; a clamping rod is arranged between the first sealing block and the second sealing block; the two ends of the clamping rod penetrate through the first sealing block and the second sealing block correspondingly and are sleeved with clamping rings; the clamping ring is in threaded connection with the clamping rod; sliding grooves are formed in the opposite side walls in the upper shell; sliding rods are arranged in the two sliding grooves; the two ends of the sliding rods are fixedly connected with the opposite side walls in the sliding grooves respectively; the sliding rods are sleeved with clamping plates in a sliding mode; rotating rods are arranged in the clamping plates; and the rotating rods are in threaded connection with the clamping plates. The packaging structure is simple in disassembly operation, improves the work efficiency, facilitates the maintenance of internal parts of the sensor, and prolongs the service life of the parts.

Description

technical field [0001] The invention belongs to the technical field of sensors, in particular to a packaging structure of a ceramic pressure sensor. Background technique [0002] The corrosion-resistant ceramic pressure sensor has no liquid transmission, and the pressure directly acts on the front surface of the ceramic diaphragm, causing a slight deformation of the diaphragm. The thick-film resistor is printed on the back of the ceramic diaphragm and connected to form a Wheatstone bridge (closed Bridge), due to the piezoresistive effect of the piezoresistor, the bridge produces a highly linear voltage signal proportional to the pressure and proportional to the excitation voltage. The standard signal is calibrated as 2.0 / 3.0 / 3.3 according to the pressure range mV / V, etc., compatible with strain gauge sensors. [0003] The packaging structure of the existing ceramic pressure sensor is relatively complicated, and the packaging structure is convenient for disassembly and maint...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22G01L9/04
CPCG01L1/2262G01L9/04
Inventor 徐鑫张科俊
Owner 无锡至鑫微科技有限公司
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