Display device packaging method

Abstract

The invention discloses a display device packaging method. The method comprises the following steps of coating the cover plate glass with a heating decomposable glue; carrying out screen printing on the frit glue, wherein the frit glue is positioned on the heating decomposable glue; and baking the heating decomposable glue and the frit glue. The decomposition temperature of the heating decomposable glue is different from the curing crystallization temperature of the frit glue, and the frit glue is still in a molten state at the decomposition temperature required for the heating decomposable glue, so that the height generated by the decomposed frit glue is poor. The frit glue in the molten state automatically flows to fill the position occupied by the original heating decomposable glue, sothat recesses generated during the screen printing of the frit glue are eliminated, and the frit glue is cured and crystallized along with the temperature rise, and accordingly the recesses generatedby the screen printing of the frit glue are eliminated, and the quality of a packaging process is improved.

Description

technical field [0001] The invention relates to the field of display packaging, in particular to a display device packaging method. Background technique [0002] In the display industry, thin-film transistors (TFT) and organic light-emitting materials are mainly used to generate light sources for OLED display devices, but thin-film transistors and organic light-emitting materials are very sensitive to oxygen and water vapor, and are easily affected by the erosion of water and oxygen in the outside air. Therefore, in the OLED display device, isolation from the external environment is very important, and the degree of isolation from the external environment directly affects the luminous effect and service life of the OLED. [0003] At present, in the manufacturing process of OLED displays, the effect of the encapsulation process directly determines the degree of isolation of the display device from the external environment. Therefore, it is very important to improve the packa...

AI Technical Summary

Problems solved by technology

In AMOLED display technology, the encapsulation process used to isolate the external environment and protect the display device mainly uses frit glue, but the screen printing machine mainly has the problem of depression in the process of printing frit glue (melted and solidified glass glue), that is, the frit glue crosses Higher on the sides of the section and a lower "saddle" in the middle

The sag phenomenon of screen printing frit glue leads to some problems in the later stage of the process, such as: when the frit glue is bonded to the TFT substrate, the surface of the frit glue cannot completely contact the surface of the TFT substrate, thereby reducing the bonding length; Voids are formed on the surface of the substrate, and bubbles are generated, etc.

These problems will cause water, oxygen, etc. in the atmospheric environment to easily invade the packaging structure, resulting in damage to the TFT substrate and organic light-emitting materials, which will cause the display device to fail to work normally or reduce the service life.

[0004] In the screen printing process, due to the limitations of screen printing machine equipment, screen specifications, frit adhesive materials, etc., there is no effective method to completely eliminate the sag at present. The methods currently used on the market can only reduce the impact of sag, but cannot Completely eliminate the sag phenomenon, therefore, fundamentally solve the frit glue sag problem, which is the direction of current packaging technology research

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