Rack type server main board based on Loongson 3A4000

A rack-type server and server technology, which is applied to instruments, chemical instruments and methods, and cleaning methods using tools, etc., can solve the problems of poor heat dissipation performance of the main board, difficult disassembly and assembly of the server main board, and aggravated the heating of the main board. Circulating water cooling effect, improving water cooling effect, improving heat dissipation effect

Active Publication Date: 2020-04-14
AVIC POWER SCI & TECH ENG
View PDF14 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The motherboard is generally a rectangular circuit board, on which are installed the main circuit systems that make up the computer. Generally, there are chips, I / O control chips, keyboard and panel control switch interfaces, indicator light connectors, expansion slots, and DC connections for the motherboard and cards. Power supply connectors and other components, however, the existing server motherboard is relatively difficult to disassemble, and it is very troublesome when the service requires that there is an abnormality in the motherboard chassis and needs to be overhauled. The heating of the main board, due to the dust covering for many years, causes the main board to dissipate heat slowly, thus causing the main board to burn out
[0003] The patent with the publication number: CN205809774U discloses a server and its internal server motherboard. Compared with this application, it cannot solve the problem proposed in this application: the existing server motherboard is relatively difficult to disassemble. When the service requires the motherboard chassis It is very troublesome to overhaul if there is an abnormality inside. The heat dissipation performance of the main board is not good when it is working, and it is easy to enter the dust, which aggravates the heat of the main board. Due to the dust covering for many years, the heat dissipation of the main board is slow, which makes the main board burn out.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rack type server main board based on Loongson 3A4000
  • Rack type server main board based on Loongson 3A4000
  • Rack type server main board based on Loongson 3A4000

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] see Figure 1-14 As shown, a rack-type server motherboard based on Loongson 3A4000 includes a server motherboard main body 1, a motherboard base 2, mounting bolts 4, a U-shaped bracket 6, a motherboard mounting frame 7, a water cooling pipe 12, a condenser 14, and a circulation Water tank 15, circulating water pump 17, cooling pipe connection seat 20 and main board installation box 24, several groups of installation through holes are arranged on main board base 2, main board base 2 is fixedly installed on main board ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a rack type server main board based on a Loongson 3A4000. A plurality of groups of mounting through holes are formed in a main board base; the main board base is fixedly mounted on a main board mounting box through mounting bolts; a Z-shaped bracket is fixedly mounted on the main board base through the mounting bolts; the upper end of the U-shaped bracket is fixedly connected with a mounting support plate; and chutes are formed in vertical plates at the two ends of the U-shaped bracket. The mounting support plate is connected to the main board base through the mountingbolts; a cooling pipe connecting base is connected into the U-shaped bracket in a sliding mode. A server mainboard is convenient and fast to mount and dismount, later overhaul and maintenance of the mainboard are facilitated, the heat dissipation effect of the mainboard is improved by arranging air cooling and water cooling heat dissipation, and therefore the use performance of the mainboard is improved, the cleaning brush is arranged to clean and remove dust on the mainboard, and the service life of the mainboard is guaranteed.

Description

technical field [0001] The invention relates to the technical field of server motherboards, in particular to a rack-mounted server motherboard based on Loongson 3A4000. Background technique [0002] The server motherboard is installed in the chassis and is one of the most basic and important components of the server. The motherboard is generally a rectangular circuit board, on which are installed the main circuit systems that make up the computer. Generally, there are chips, I / O control chips, keyboard and panel control switch interfaces, indicator light connectors, expansion slots, and DC connections for the motherboard and cards. Power supply connectors and other components, however, the existing server motherboard is relatively difficult to disassemble, and it is very troublesome when the service requires that there is an abnormality in the motherboard chassis and needs to be overhauled. The heating of the main board, due to the dust covering for many years, causes the m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18B08B1/00
CPCB08B1/002B08B1/008G06F1/184G06F1/20
Inventor 李光明金维国
Owner AVIC POWER SCI & TECH ENG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products