A Design Method to Solve the Production Deviation of qfn Package Parts

A design method and packaging-like technology, applied in the server field, to increase the welding area, improve the welding quality, and ensure the welding reliability.

Active Publication Date: 2022-02-18
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem that the welding of packaged parts is prone to deviation, the present invention provides a design method to solve the production deviation of QFN packaged parts, which can avoid the occurrence of the above-mentioned problems

Method used

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  • A Design Method to Solve the Production Deviation of qfn Package Parts
  • A Design Method to Solve the Production Deviation of qfn Package Parts
  • A Design Method to Solve the Production Deviation of qfn Package Parts

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Embodiment Construction

[0018] Such as Figure 1 to 3 As shown, a design method for solving the production of partial production of the QFN package, its steps are:

[0019] 1) The bottom surface of the package part extends to both sides to form an epitaxial horizontal pin and a vertical lead in the vertical direction. See figure 1 As shown in the present embodiment, the package part is a crystal oscillator 1, and the crystal bottom surface pin extends to the outside of the crystal bottom surface to form an epitaxial horizontal pin 2, and a vertical lead 3 is provided on the epitaxial pin 3. Due to the increase of the epitaxial level pin, it is equivalent to increasing the entire area of ​​the bottom surface pin of the crystal, which is more stable when the entire crystal hit is placed on the PCB, and the welding is not easily offset; the design of the vertical pin makes the side surface also solder The part can increase the welding area of ​​the entire part.

[0020] 2) Inside the epitaxial horizontal pin...

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Abstract

A design method for solving the production deviation of QFN packaged parts, which relates to the server field, the steps are as follows: the pins on the bottom surface of the packaged parts are extended to both sides to form an extended horizontal pin and a vertical pin is provided in the vertical direction; The inside of the extension horizontal pin is provided with a large-area hollow. A gap is provided in the middle of the vertical pin. There are multiple horizontal notches extending left and right on both sides of the gap. The invention can solve the problem of production deviation of QFN-type packaged parts: for example, the center of gravity is easily unstable. After the welding is completed, the problem of deviation occurs, resulting in the parts not being in good contact with the PCB. After improvement, this Such parts will not be misaligned during production, and at the same time, the welding area can be increased, the welding quality can be improved, and the welding reliability can be ensured, thus ensuring the stability and safety of the product.

Description

Technical field [0001] The present invention relates to the field of servers, and in particular to a design method of solving parts production biases of QFN package. Background technique [0002] With the increase in the type of personal electronic consumer goods, the development of various data clouds, the application range of server and personal electronic consumer goods is more and more wide. The number of applications that cause electronic parts of the electronic industry has increasing, and the frequency of the additional signal is getting higher and higher, and the QFN package is increasingly adopted. Since some parts pin is very much, if this leak pin is used The package will reduce the area of ​​the part and use the bottom pin, which can be larger than the normal package of materials, the area of ​​the bottom surface, has excellent electrical performance. [0003] In some parts, such as crystal, such part is small, plus high degree of unable to do very low, in actual prod...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
CPCH01L21/4885
Inventor 于浩刘进锁
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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