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Large-pressure flip-chip bonding flexible pressurizing method of chip substrate

A high-pressure, bonding technology that is used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc.

Active Publication Date: 2020-04-14
西北电子装备技术研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a flexible pressurization mechanism for high-pressure flip-chip bonding of chip substrates, which solves the technical problems of how to perform flexible pressurization in the early stage of pressurization and monitor the pressurization process

Method used

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  • Large-pressure flip-chip bonding flexible pressurizing method of chip substrate
  • Large-pressure flip-chip bonding flexible pressurizing method of chip substrate
  • Large-pressure flip-chip bonding flexible pressurizing method of chip substrate

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Embodiment Construction

[0017] The present invention is described in detail below in conjunction with accompanying drawing:

[0018] A chip substrate high-pressure flip-chip bonding flexible pressurization mechanism, including a press base 301, a box-shaped frame 302 is fixedly installed on the press base 301, and a servo press is fixedly installed on the top plate of the box-shaped frame 302. Machine 314, four guide columns 303 are arranged between the top plate of the box frame 302 and the press table base 301, and a movable beam 304 is movably connected on the four guide columns 303, and at the center of the lower bottom surface of the movable beam 304 The lower connecting plate 305 is fixedly arranged, the upper jig suction cup 306 is arranged on the lower bottom surface of the lower connecting plate 305, the cylindrical concave groove 307 is arranged on the upper top surface of the movable beam 304, and the cylindrical concave groove 307 A pressure sensor 308 is provided at the bottom of the gro...

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PUM

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Abstract

The invention discloses a large-pressure flip-chip bonding flexible pressurizing method of a chip substrate, and problems of how to carry out flexible pressurizing at an initial stage of pressurizingand how to monitor the pressurizing process are solved. A cylindrical concave groove (307) is arranged in an upper top surface of a movable cross beam (304); a pressure sensor (308) is arranged at a bottom of the cylindrical concave groove; a stud (310) with a step is screwed in a threaded hole (309) in the middle of a top end of the pressure sensor; a laminated spring (311) is arranged on an annular step of the stud (310) with the step; a pressure conduction sleeve (312) sleeves the stud (310) with the step on the laminated spring , a groove top cover (317) with a center hole is arranged at the top end of the cylindrical concave groove, and a shaft end of a servo press pressing output shaft (313) penetrates through the center hole of the groove top cover (317) with the center hole and then abuts against the top end surface of the pressure conduction sleeve (312); and process requirements of bonding of chips with different specifications are met.

Description

technical field [0001] The invention relates to a flip-chip bonding device, in particular to a flexible pressurizing mechanism on a high-pressure flip-chip bonding machine when performing high-pressure flip-chip bonding on a chip substrate. Background technique [0002] Flip-chip bonding technology directly connects the bare chip to the substrate through solder balls, eliminating the need for wire connections between the chip and the substrate, forming the shortest connection path between the chip and the substrate, and obtaining good electrical performance and comparative High packaging speed, high packaging density, good frequency characteristics after packaging, and improved production efficiency; with the continuous increase of chip size and specifications, greater bonding pressure is required during flip-chip bonding to achieve chip and substrate bonding. The traditional flip-chip bonding equipment can no longer meet the bonding requirements of larger-sized chips; at pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/56
CPCH01L21/67121H01L21/67126H01L21/67253H01L21/563
Inventor 张志耀田芳韦杰李伟张燕郝鹏飞孙丽娜李俊杰
Owner 西北电子装备技术研究所