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A method of manufacturing a pcb

A manufacturing method and technology of copper foil, which are applied in multilayer circuit manufacturing, printed circuit manufacturing, and simultaneous processing of multiple printed circuits, etc., can solve problems such as difficulty in the manufacturing process, and achieve the purpose of avoiding copper foil damage and preventing copper foil from wrinkling. Effect

Active Publication Date: 2022-05-13
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This structure is special and novel, and it is a trend of energy-related PCB products to develop towards small volume and high density. Upgrading and improving the manufacturing method

Method used

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  • A method of manufacturing a pcb
  • A method of manufacturing a pcb
  • A method of manufacturing a pcb

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] This embodiment provides a method for manufacturing a PCB, which is suitable for manufacturing a PCB product in which the copper layer on the surface partially protrudes inward, and multiple PCB products can be obtained by one pressing.

[0052] like figure 2 As shown, the preparation method includes the following steps:

[0053] S11, milling the bonding sheet into a hollow bonding sheet frame.

[0054] like figure 1 As shown, the bonding sheet frame 1 is a rectangular frame, and its outer frame 11 is the same size as the substrate used in the subsequent steps and the copper foil to be processed. According to the size of the copper foil to be processed, set the appropriate frame width. On the one hand, it is necessary to ensure that the substrate and copper foil are firmly bonded, and on the other hand, it is necessary to reduce glue flow during pressing.

[0055] S12, providing a plurality of substrates, sequentially stacking the bonding sheet frame and copper foil...

Embodiment 2

[0071] This embodiment is improved on the basis of the above embodiments, such as Figure 5 As shown, the improved production method includes the following steps:

[0072] S21 , milling the bonding sheet into a hollow bonding sheet frame, the bonding sheet frame including inwardly protruding ears corresponding to the tool holes.

[0073] like Figure 4 As shown, in addition to the part of the rectangular frame, the bonding sheet frame 1 also includes one or more inwardly protruding ear parts 13, and the ear parts 13 correspond to the tool holes used when the copper foil 31 is pressed together. set up. Before step S26, the tool hole is opened in the area corresponding to the ear portion 13 on the single-sided laminated board 91 and the double-sided laminated board 92, so that the tool hole on the copper foil 31 and the substrate 2 The ear portion 13 of the solidified bonding sheet frame 1 can prevent liquid medicine from entering the gap between the substrate 2 and the coppe...

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Abstract

The invention discloses a PCB manufacturing method and relates to the technical field of printed circuit boards. The manufacturing method includes: milling the adhesive sheet into a hollow adhesive sheet frame; providing multiple substrates, sequentially stacking the adhesive sheet frame and copper foil on one or both sides of the substrate, and pressing to obtain a single-sided layer board and double-sided laminated board; change the thickness of copper foil by electroplating, etching or pasting copper blocks on the surface of copper foil; laminate single-sided laminated board, double-sided laminated board with prepreg and sub-board, and press them together to obtain Motherboard; mill off the part of the motherboard corresponding to the bonding sheet frame. In the present invention, the laminated board is obtained by pressing the copper foil with the adhesive sheet frame and the substrate, providing a carrier for the copper foil, keeping the copper foil flat, and avoiding damage to the copper foil. Second, multiple PCB sheets can be stacked at one time, and then the frame part of the bonding sheet can be cut after lamination, and the carrier can be removed, and multiple PCB finished products can be obtained at one lamination.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a PCB. Background technique [0002] With the rapid development of the PCB industry, the product structure is gradually upgraded, showing diversification and complexity, and the difficulty of production is greatly increased. At present, there is an energy-based thick copper PCB product, which is designed to require gold fingers and other parts to be plated on the inside of the board. Thick copper, the purpose is to achieve efficient transmission of current while the outer surface is flat to meet the requirements of gold finger insertion and device welding of finished products. This structure is special and novel, and it is a trend of energy-based PCB products to develop towards small volume and high density. However, due to its particularity, the manufacturing process is relatively difficult. Traditional processes cannot process such stru...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0097H05K3/4611H05K2203/068
Inventor 刘梦茹林宇超王洪府纪成光陈正清
Owner DONGGUAN SHENGYI ELECTRONICS