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A method of manufacturing a circuit board

A manufacturing method and circuit substrate technology, applied to circuits, chemical/electrolytic methods to remove conductive materials, electrical components, etc., can solve problems such as circuit substrate pollution and damage, and achieve the effect of avoiding pollution or damage

Active Publication Date: 2021-07-23
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Description
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Problems solved by technology

Therefore, the target material c of the circuit substrate produced by the above-mentioned conventional process will have a certain degree of pollution and damage

Method used

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  • A method of manufacturing a circuit board
  • A method of manufacturing a circuit board
  • A method of manufacturing a circuit board

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the invention shown in and described with reference to the drawings are merely exemplary, and the invention is not limited to these embodiments.

[0026] Here, it should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, only the structures and / or processing steps closely related to the solution according to the present invention are shown in the drawings, and the related Other details are not relevant to the invention.

[0027] This embodiment provides a method for manufacturing a circuit substrate, the method comprising:

[0028] A mask layer and a material layer 4 for forming a tar...

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Abstract

The invention discloses a method for manufacturing a circuit substrate. The method includes: sequentially forming a mask layer and a material layer for forming a target layer on a substrate, wherein the mask layer is located at the side of the material layer and is connected with the material layer. There is a space between them; forming a mechanical peeling layer covering the material layer on the substrate; removing the mask layer, and mechanically peeling and removing the mechanical peeling layer, so as to form the target layer. The invention solves the problem that the target material of the circuit substrate produced by the conventional process is easily polluted and damaged.

Description

technical field [0001] The invention relates to the technical field of circuits, in particular to a method for manufacturing a circuit substrate. Background technique [0002] Such as Figure 1a to Figure 1d As shown, the current general process of making a circuit substrate is: forming a sacrificial layer b on a substrate a; etching the sacrificial layer b to form a mask b'; depositing a target material c on the substrate a (for wires constituting the circuit substrate); remove the mask b'. However, during the process of removing the mask b', the target material c layer will be affected by the etchant used to remove the mask b'. Therefore, the target material c of the circuit substrate produced by the above-mentioned conventional process will be polluted and damaged to a certain extent. Contents of the invention [0003] In order to achieve the above-mentioned purpose, the present invention adopts following technical scheme: [0004] A method for manufacturing a circui...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/492H05K3/06
CPCH01L21/4821H01L23/492H05K3/06
Inventor 熊康林陆晓鸣孙骏逸黄永丹冯家贵武彪
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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