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Graphene far infrared floor heating brick

A graphene and graphene composite technology, which is applied to ceramic products, other household utensils, clay products, etc., can solve problems such as easy penetration of water or other liquids, easy to fall off at wiring points, rapid heating of unheated spaces, etc., to achieve splicing The effect of simple connection operation, improved heat transfer and cooling efficiency, and expanded heat transfer area

Active Publication Date: 2021-07-23
戴明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current problems faced by floors and floor tiles using graphene heating chips are that the heat dissipation effect is not ideal, the heated space cannot be heated quickly, and the functionality is poor.
In addition, when the existing graphene heating floor tiles are laid, they are connected to each other through the joints on the side and energized. When splicing, the joints are easy to fall off, and the side is just a joint gap, which is very easy to seep into water or other liquids, resulting in water entering the joints and affecting heat generation. The normal heating of the floor tiles, the graphene heating layer is easy to be damp, which further reduces the thermal conductivity

Method used

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  • Graphene far infrared floor heating brick
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  • Graphene far infrared floor heating brick

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Embodiment Construction

[0032] In order to make the purpose, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0033] A graphene far-infrared floor heating brick, including brick units 1 that are laid front and back and connected and installed between adjacent brick units 1; connectors 2; Figure 1-2 shown. The brick unit 1 includes a bottom brick 12 and a panel 11 from bottom to top, the bottom brick 12 includes a bottom frame 120 and a graphene heat conduction component 121, the bottom frame 120 is a shallow plate structure with a depression in the middle of the upper surface, the The graphene heat conduction assembly 121 is arranged in the depression; the graphene heat...

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Abstract

The invention relates to a graphene far-infrared floor heating brick, which includes a brick unit and a connecting piece installed between adjacent brick units; the brick unit includes a bottom brick and a panel from bottom to top, and the bottom brick includes a bottom frame and a graphene heat-conducting component ;The graphene heat-conducting component is equipped with a heating film; the panel includes a surface layer, and the bottom surface of the surface layer is provided with a groove, and a heat-conducting brick layer is bonded in the groove; the two sides of the bottom brick are inwardly inclined from top to bottom The two sides of the panel extend outwards to form a connecting part, the bottom of the connecting part is concave to form a concave interface, and the side of the bottom brick is provided with a socket, and the heating film is connected to the socket through a wire; the connecting part is a trapezoidal cross-section Strip structure, the trapezoidal slopes on both sides are matched with the hypotenuses, the two ends of the upper surface of the trapezoidal slope are provided with joints that match the concave interface, the lower part of the trapezoidal slope is provided with an insert that matches the socket, and the two sides Plugs are made of connected copper strips. The floor heating tile has good heat dissipation effect, simple laying and splicing operation and high safety.

Description

technical field [0001] The invention relates to the field of heating plates made of electrothermal materials, in particular to a graphene far-infrared floor heating brick. Background technique [0002] Traditional heating systems include radiators, air conditioners, point heating systems represented by radiators, and linear heating systems represented by heating cables. Traditional heating methods have the advantages of large energy consumption, large space occupation, and low heat utilization rate. and other shortcomings. [0003] At present, heating with heating chips has been developed as a new heating method. The heating chips are made of conductive special ink and metal current-carrying strips, which are processed and hot-pressed between insulating polyester films. When working, the electric heating film is used as the heating body, and the heat is sent into the space in the form of radiation, and its comprehensive effect is better than the traditional convection heati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04F15/02E04F15/18H05B3/14H05B3/34C04B38/00C04B33/135
CPCC04B33/1352C04B38/00C04B2235/3418E04F15/02044E04F15/02161E04F15/181H05B3/14H05B3/34Y02P40/60
Inventor 戴明
Owner 戴明