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Manufacturing method of ultra-precision circuit

A manufacturing method and ultra-precise technology, applied in multi-layer circuit manufacturing, printed circuit manufacturing, removing conductive materials by chemical/electrolytic methods, etc., can solve problems such as the inability to manufacture ultra-precision circuits, and achieve the effect of avoiding side erosion problems

Active Publication Date: 2020-04-21
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the above-mentioned existing technical defects, the present invention provides a method for manufacturing an ultra-precise circuit, which can produce an ultra-precise circuit by combining negative and positive processes, and solves the problem that the conventional circuit process cannot be produced due to side erosion and side plating. Problems in making ultra-precise circuits

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The manufacturing method of a circuit board shown in this embodiment can be used to produce an ultra-precision circuit with a minimum line width and gap of 2 / 2mil (50 / 50 μm), which includes the following processing steps in sequence:

[0028] (1) Cutting: The core board is cut out according to the panel size of 520mm×620mm. The thickness of the core board is 0.35mm (excluding the thickness of the outer copper layer), and the thickness of the copper layer on both surfaces of the core board is 1OZ.

[0029] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) to complete the exposure of the inner layer circuit, and form the inner layer circuit pattern after development; inner layer etching, etch the inner layer ...

Embodiment 2

[0044] The manufacturing method of a circuit board shown in this embodiment can be used to produce an ultra-precision circuit with a minimum line width and gap of 2 / 2mil (50 / 50 μm), which includes the following processing steps in sequence:

[0045] (1) Cutting: The core board is cut out according to the panel size of 520mm×620mm. The thickness of the core board is 0.35mm (excluding the thickness of the outer copper layer). The thickness of the copper layer on both surfaces of the core board is 4-5μm, and the The thickness of the surface copper layer is smaller than the thickness of the copper layer of the circuit required by the design.

[0046] (2) Drilling: According to the existing drilling technology, according to the design requirements, the through holes used to conduct the upper and lower layers of the circuit are drilled on the core board, and the aperture of the through hole is pre-larged by 0.025 on the basis of the designed aperture. mm, to avoid the problem of sma...

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Abstract

The invention discloses a manufacturing method of an ultra-precision circuit. The method comprises the following steps that: S1, an outer-layer circuit is manufactured on an outer-layer copper surfaceof a production board through a negative film process, and it is ensured that the thickness of the outer-layer copper surface is smaller than a circuit copper layer thickness required by design; S2,a film is pasted on the production board through a positive film process, and exposing and developing are performed sequentially, so that an outer-layer circuit pattern is formed, and the outer-layercircuit manufactured in the step S1 is exposed; S3, the copper layer thickness of the outer-layer circuit on the production board is made to be the circuit copper layer thickness required by design through pattern electroplating; and S4, finally, the film is removed. According to the method, the ultra-precise circuit can be manufactured by adopting a mode of combining the negative film process andthe positive film process; and the problem that the ultra-precise circuit cannot be manufactured due to side etching and side electroplating in a conventional circuit process is solved.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing ultra-precise circuits. Background technique [0002] Printed circuit board (PCB) forms lines by coating dry film / wet film, exposure, development, electroplating, etching and other processes on a type of copper-clad core board, and forms between metallized holes and lines Electrical interconnection, which is the basic application principle of PCB. Conventional PCB circuit production can be divided into positive film method and negative film method according to different processes. The main differences are as follows: [0003] Positive film process: material cutting→inner layer→pressing→drilling→copper sinking→plate electricity→outer layer graphics→graphic plating→outer layer alkaline etching→post process; [0004] Negative film process: material cutting→inner layer→pressing→drilling→copper sinking→plate electricity→outer l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06H05K3/46H05K3/42H05K3/00
CPCH05K3/0047H05K3/06H05K3/42H05K3/4611
Inventor 徐文中徐杰栋涂波胡志杨李江
Owner JIANGMEN SUNTAK CIRCUIT TECH
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