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Substrate processing apparatus, and substrate processing method

A substrate processing device and a technology for a substrate processing method are applied in cleaning methods and utensils, chemical instruments and methods, cleaning methods using liquids, etc., and can solve problems such as defocusing and insufficient removal, and achieve the effect of inhibiting adhesion

Pending Publication Date: 2020-04-24
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The polymer adhering to the back surface of the substrate cannot be sufficiently removed by plasma ashing, which may cause problems such as defocusing in the exposure process

Method used

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  • Substrate processing apparatus, and substrate processing method
  • Substrate processing apparatus, and substrate processing method
  • Substrate processing apparatus, and substrate processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0055] Hereinafter, this embodiment will be described with reference to the drawings. In addition, in the drawings, the same reference numerals are assigned to the same or corresponding parts, and descriptions thereof will not be repeated.

[0056] refer to figure 1 An embodiment of the substrate processing apparatus 100 will be described. figure 1 It is a schematic diagram of the substrate processing apparatus 100 of this embodiment.

[0057] The substrate processing apparatus 100 processes a substrate W. As shown in FIG. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, property imparting, process film formation, removal of at least a part of the film, and cleaning of the substrate W.

[0058] The substrate W includes, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for field emission displays (Field Emission Display: FED), ...

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PUM

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Abstract

The present invention provides a substrate processing apparatus, and a substrate processing method capable of inhibiting the filling material to be attached to the back surface of the substrate. The substrate processing apparatus (100) processes a substrate W having an upper side and a rear side. The substrate processing apparatus (100) includes a substrate holder (120), a filler feeder (150), anda first cleaning liquid feeder (160). The substrate holder (120) rotates the substrate (W) while holding a central portion of the rear side of the substrate (W). The filler feeder (150) feeds fillerto the upper side of the substrate (W) held by the substrate holder (120). The first cleaning liquid feeder (160) feeds a cleaning liquid to the rear side of the substrate (W) held by the substrate holder. The first cleaning liquid feeder (160) feeds the cleaning liquid to an area, held by the substrate holder (120), of the rear side of the substrate (W).

Description

technical field [0001] The present invention relates to a substrate processing device and a substrate processing method. Background technique [0002] It is known that substrates used in electronic components such as semiconductor devices and liquid crystal display devices are processed by a substrate processing apparatus. As the processing of the substrate, in the manufacturing process of electronic components, a process of repeatedly performing processes such as film formation and etching on the surface of the substrate to form a fine pattern is performed. Among them, in order to perform fine processing on the surface of the substrate, it is necessary to keep the surface of the substrate clean. Therefore, typically, the surface of the substrate is cleaned with a rinse solution. In this case, after the cleaning process is completed, it is necessary to remove the rinse liquid adhering to the surface of the substrate to dry the substrate. [0003] One of the important issu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/68H01L21/02
CPCH01L21/67051H01L21/68H01L21/02H01L21/02057H01L21/67028H01L21/6838H01L21/68792G03F7/40H01L21/02087H01L21/68721B08B3/041H01L21/0209
Inventor 金松泰范中井仁司奥谷学
Owner DAINIPPON SCREEN MTG CO LTD