A liquid drainage cover and semiconductor cleaning equipment
A technology for cleaning equipment and liquid outlets, which is applied in semiconductor/solid-state device manufacturing, smoke and dust removal, cleaning methods and appliances, etc. It can solve the problems of increasing the space occupied by equipment and achieve the effect of reducing the occupied space
Active Publication Date: 2022-06-07
PNC PROCESS SYSTEMS CO LTD +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
At present, single wafers are cleaned by using semiconductor cleaning equipment. The upper and lower sides of the circle, the cleaning process involves the discharge of the cleaning liquid and the discharge of the gas, and the separate arrangement of the liquid discharge mechanism and the exhaust mechanism increases the occupied space of the equipment
Method used
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Embodiment Construction
[0047] The core of the present invention is to provide a liquid drain cover and semiconductor cleaning equipment, so as to reduce the space occupied by the equipment.
[0048] In addition, the embodiments shown below do not have any limiting effect on the content of the invention described in the claims. In addition, the whole content of the structure shown in the following embodiment is not limited to what is necessary for the solution of the invention described in the claim.
[0049] see Figure 1 to Figure 14 , a liquid drain cover in the embodiment of the present invention, comprising:
[0050] The outer casing 100, the outer casing 100 is provided with an air intake channel 101;
[0051] The inner casing 200, the inner casing 200 is rotatably disposed on the outer casing 100, the interior of the inner casing 200 or the interior of the outer casing 100 forms a drainage cavity 300, and the inner casing 200 and / or the outer casing 100 surrounds An exhaust cavity 400 is fo...
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The invention discloses a liquid discharge cover and semiconductor cleaning equipment. By adopting the liquid discharge cover of the present invention, the conduction and non-conduction between the air intake channel and the suction hole can be switched by rotating the outer shell or the inner shell. When the air intake channel is connected with the suction hole, the gas located in the liquid discharge cover can enter the exhaust cavity through the air intake channel and the suction hole, and be discharged from the exhaust port; When it is turned on, the gas in the liquid discharge hood cannot be discharged through the device; at the same time, the liquid collected in the liquid discharge cavity is discharged through the liquid discharge port. It can be seen that the liquid discharge cover of the present invention can perform liquid discharge or exhaust or only liquid discharge at the same time, and one device has both functions of liquid discharge and exhaust, thereby reducing the occupied space of the device.
Description
technical field [0001] The present invention relates to the technical field of semiconductor processing, and more particularly, to a liquid drain cover and semiconductor cleaning equipment. Background technique [0002] In order to effectively remove the residues, fine dust, and dirt from the surface structure of the single wafer, the surface of the single wafer needs to be cleaned. At present, the single wafer is cleaned by using semiconductor cleaning equipment. When cleaning the single wafer, the single wafer is placed in the cavity of the semiconductor cleaning equipment, the single wafer is rapidly rotated, and the single crystal is cleaned by a gas jet. The upper and lower sides of the circle are related to the discharge of cleaning liquid and the discharge of gas during the cleaning process, and the separate setting of the liquid discharge mechanism and the exhaust mechanism increases the occupied space of the equipment. [0003] Therefore, how to reduce the space oc...
Claims
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IPC IPC(8): B08B15/02H01L21/67
CPCB08B15/02H01L21/67051
Inventor 邓信甫
Owner PNC PROCESS SYSTEMS CO LTD