Drive device for polishing disk

Abstract

The invention provides a drive device for a polishing disk. The drive device includes a fixing disk, a rotating mechanism, a machine frame and a horizontal moving mechanism. The fixing disk is internally provided with a cooling flow channel, and the fixing disk is connected with the polishing disk. The rotating mechanism includes a main shaft and a first drive component for driving the rotation ofthe main shaft, and the fixing disk is connected to the upper end of the main shaft. A cooling pipe communicating with the cooling flow channel is arranged in the main shaft in a penetrating mode, and the main shaft can rotate to drive the fixing disk and the polishing disk to rotate synchronously. The machine frame is provided with a supporting frame, and the first drive component is connected to the machine frame. The horizontal moving mechanism includes a moving plate and a second drive component, and the moving plate sleeves the outer part of the main shaft and is connected with the supporting frame. The second drive component is connected with the moving plate and can drive the moving plate to perform horizontally reciprocating movement, and the moving plate can move to drive the machine frame to move synchronously. The drive device for the polishing disk can not only cool the polishing disk, but also make full use of the usable area of a polishing pad to avoid excessive wear ofthe polishing pad caused by polishing at a same position.

Description

technical field [0001] The invention relates to the technical field of silicon wafer polishing, in particular to a driving device for a polishing disk. Background technique [0002] In the semiconductor processing technology, when the wafer (silicon wafer) is subjected to stress-free polishing, the uniformity of the surface polishing of the wafer is controlled to ensure that all parts of the surface of the wafer, especially the center and edge areas of the wafer, are thrown away as much as possible. The thickness is equivalent, which is of great significance to the smooth progress of the subsequent process and the improvement of the product yield. [0003] However, the flatness of the currently used polishing disc is difficult to guarantee, which makes the polishing pad placed on it deviate from the axis line of the polishing head, and cannot be effectively cooled during work, resulting in uneven force and temperature deviation on the surface of the silicon wafer. Even lead...

AI Technical Summary

Problems solved by technology

[0003] However, the flatness of the currently used polishing disc is difficult to guarantee, which makes the polishing pad placed on it deviate from the axis line of the polishing head, and cannot be effectively cooled during work, resulting in uneven force and temperature deviation on the surface of the silicon wafer. Even lead to deformation and chipping, thereby affecting the quality of silicon wafer polishing

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