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Alkaline water-soluble resin with high refractive index and preparation method and high refractive index photoresist

A high-refractive-index, soluble technology, applied in the photoengraving process of the pattern surface, photosensitive materials for opto-mechanical equipment, optics, etc., can solve the problem of large under-cut, low refractive index of photoresist, and insufficient curing of the bottom layer. and other problems, to achieve the effect of improving resolution, good light transmission, and improving deep curing performance

Active Publication Date: 2022-03-11
WUXI DERBELL PHTO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the process of realizing the present invention, the inventors found that the photoresist of the prior art has a low refractive index, which leads to at least the following problems: the photoresist of the prior art has a low refractive index, so the photoresist coated on the PCB substrate The light transmittance of the adhesive film is poor, so that UV light cannot completely penetrate the photoresist, which eventually leads to insufficient curing of the bottom layer, and the under-cut after development is large, resulting in a decrease in resolution; Slow down, affecting production capacity; In addition, PCB exposure machines mostly use astigmatism light sources for exposure, so UV light will be refracted at the photoresist interface, the lower the refractive index, the larger the refraction angle, resulting in photosensitive non-exposed areas, thus forming burrs, lower resolution

Method used

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  • Alkaline water-soluble resin with high refractive index and preparation method and high refractive index photoresist

Examples

Experimental program
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Effect test

Embodiment 1

[0035] In the reactor, add 39 parts of solvent propylene glycol methyl ether acetate, 49 parts of o-phenylphenoxyethyl acrylate, 12 parts of acrylic acid and 0.6 part of azobisisobutylcyanide,

[0036] Under the protection of nitrogen, the temperature was raised to 90°C, and the polymerization reaction was carried out. The reaction was completed in 6 hours, and an alkali-water-soluble resin with a high refractive index was obtained;

[0037] Its weight-average molecular weight is 80,000 (Mw), its molecular weight distribution index is 2.05, its acid value is 100 mg KOH / g, and its dry resin has a refractive index of 1.568.

Embodiment 2

[0039] Add 50 parts of solvent propylene glycol methyl ether acetate, 40 parts of phenoxybenzyl acrylate, 10 parts of acrylic acid and 0.5 part of azobisisobutyronitrile into the reaction kettle, and raise the temperature to 90°C under the protection of nitrogen to carry out the polymerization reaction, reaction 7 At the end of the hour, an alkali-water-soluble resin with a high refractive index is obtained;

[0040] Its weight-average molecular weight is 55,000 (Mw), its molecular weight distribution index is 1.98, its acid value is 78 mg KOH / g, and its dry resin has a refractive index of 1.558.

Embodiment 3

[0042] Add 39 parts of solvent dipropylene glycol monomethyl ether, 55 parts of biphenylmethanol acrylate, 6 parts of acrylic acid and 0.4 part of azobisisobutyrocyanide into the reaction kettle, and raise the temperature to 80°C under the protection of nitrogen to carry out the polymerization reaction. Reaction 4 At the end of the hour, an alkali-water-soluble resin with a high refractive index is obtained;

[0043] Its weight-average molecular weight is 100,000 (Mw), its molecular weight distribution index is 2.13, its acid value is 50 mg KOH / g, and its dry resin has a refractive index of 1.600.

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Abstract

The present invention relates to a kind of alkali water soluble resin of high refractive index, it is characterized in that it is obtained by the copolymerization of monofunctionality high refractive index monomer and acrylic acid or methacrylic acid or / and acrylate monomer; High refractive index alkaline water The weight-average molecular weight of the soluble resin is 2-150,000, the acid value is 50-100 mgKOH / g, and the refractive index is greater than or equal to 1.50. The invention also relates to a preparation method of the high-refractive-index alkali-water-soluble resin and a high-refractive-index photoresist containing the high-refractive-index alkali-water-soluble resin. The invention has the advantage that the alkali water-soluble resin with high refractive index and the photoresist with high refractive index have higher refractive index and light transmittance.

Description

technical field [0001] The invention relates to a high-refractive-index alkali water-soluble resin, in particular to a high-refractive-index alkali-water-soluble resin, a preparation method and a high-refractive index photoresist. Background technique [0002] Photoresist is used in the image transfer process of the inner circuit manufacturing of printed circuit boards. In the image transfer process, a key process is required, which is the exposure process, that is, the photoresist is exposed to UV light of a certain wavelength. With the development of the electronics industry, the inner layers of printed circuit boards are getting thinner and denser, and the manufacturing speed is getting faster and faster. Therefore, the resolution of photoresist is getting higher and higher, and the photosensitive speed is also required to be faster and faster. [0003] The prior art photoresist usually uses modified o-cresol novolac epoxy acrylic resin, pure acrylic resin or esterified ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/30C08F220/18C08F220/06G03F7/004G03F7/027
CPCC08F220/30C08F220/18G03F7/004G03F7/027
Inventor 朱贤红
Owner WUXI DERBELL PHTO ELECTRONICS MATERIAL
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