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30results about How to "Fast exposure" patented technology

Exposure adjustment method and device, camera and computer storage medium

ActiveCN109474790AExposure adjustments are accurateAvoid repeated exposure adjustmentsTelevision system detailsColor television detailsComputer scienceVideo camera
The invention discloses an exposure adjustment method and device, a camera and a computer storage medium, and belongs to the technical field of cameras. The method, the device, the camera and the medium are used for using an explore value, which is after taking effect by prediction adjustment, as a basis of exposure adjustment, and thus alleviating the overshooting problem occurring in the prior art. The method includes: obtaining an estimated explore value, which is after taking effect by setting of lastly output exposure parameter values, according to an explore value of a shot current picture and historical exposure parameter values corresponding to the explore value of the current picture, wherein exposure parameters include a gain, a shutter or an aperture; determining whether a ratioof a target explore value (TEV) to the estimated explore value is in a preset range; and when it is determined that the ratio of the target explore value to the estimated explore value is not in thepreset range, determining a new exposure parameter value according to on the ratio of the target explore value to the estimated explore value, and carrying out exposure adjustment according to the newexposure parameter value.
Owner:ZHEJIANG DAHUA TECH CO LTD

Exposure device and exposure method for electronic endoscope

The invention discloses an exposure device and an exposure method for an electronic endoscope. The exposure device comprises an image detection module, an image processing module and an image output module, wherein the image detection module comprises an image detector, a brightness statistics module and a shutter value control module. The exposure method comprises the following steps: transmitting a video signal of a detection region to the brightness statistics module by the image detector, obtaining a current brightness value Yc and a target brightness value Ya through the brightness statistics module, and transmitting the current brightness value Yc and the target brightness value Ya to the shutter value control module; calculating a target shutter value Sa and controlling a shutter to reach proper exposure quantity by the shutter value control module; sending the video signal of the detection region under the proper exposure quantity to the image processing module by the image detector; performing image processing on the received video signal by the image processing module, and transmitting the processed video signal to the image output module for outputting. According to the exposure device and the exposure method, a detection image is relatively clear, a situation of overexposure or over-darkness is avoided, the exposure speed is increased, and the problems of dazzling and flickering of the image are solved.
Owner:CHONGQING JINSHAN SCI & TECH GRP

Thin film transistor liquid crystal display (TFT-LCD) array substrate and manufacturing method thereof

The invention relates to a thin film transistor liquid crystal display (TFT-LCD) array substrate and a manufacturing method thereof. The manufacturing method comprises the following steps of: depositing a grid metal film, a grid insulation layer and a semiconductor film to form a figure comprising a grid line and a quasi semiconductor layer; depositing a passivation layer to form a semiconductor layer figure, a figure comprising a source electrode via hole and a drain electrode via hole on the semiconductor layer, and a doped semiconductor layer on the surface of the semiconductor layer in the source electrode via hole and the drain electrode via hole; and depositing a transparent conductive film and a source and drain metal film to form a figure comprising a pixel electrode, a data line,a source electrode and a drain electrode, wherein the source electrode is connected with the semiconductor layer through the doped semiconductor layer in the source electrode via hole and the drain electrode is connected with semiconductor layer through the doped semiconductor layer in the drain electrode via hole. The TFT-LCD array substrate can be manufactured through three times of processes, so the process is relatively simple, the process time can be shortened to the maximum extent, the production efficiency is improved, and the production cost is reduced.
Owner:BOE TECH GRP CO LTD +1

High-speed continuous automatic exposure machine

The invention discloses a high-speed continuous automatic exposure machine, and the exposure machine comprises a supporting table; a plurality of supporting columns are fixedly connected to the upperend of the supporting table, a working table plate is connected to the upper ends of the supporting columns in a solitary manner, a connecting frame is fixedly connected to the rear portion of the upper end of the working table plate, and a transverse moving mechanism is fixedly connected to the upper portion of the front end of the connecting frame. A lifting mechanism is movably connected to thefront portion of the transverse moving mechanism, a first machine base is fixedly connected to the middle of the upper end of the connecting frame, a first motor is fixedly connected to the upper endof the first machine base, a supporting frame is fixedly connected to the left portion of the upper end of the connecting frame, and an exposure device is fixedly connected to the front portion of the lower end of the supporting frame. According to the high-speed continuous automatic exposure machine, the feeding, exposure, feeding and other operation processes are fully automatic, the exposure speed is high, an operator does not need to carry out frame placing preparation, unnecessary waiting time is saved, production efficiency is improved, productivity is improved, and electric energy consumption can be reduced.
Owner:嘉善福广电子科技股份有限公司

A high-speed image exposure method for dmd maskless lithography machine

The invention discloses a high-speed image exposure method for a DMD maskless lithography machine, optimizes the DMD lithography exposure control process, avoids directly sending real-time exposure images to the DMD for exposure by the host computer software, and uses a storage device instead The image to be processed is cached, and the high-speed real-time exposure image processing is completed through the DMD control board instead of the host computer software, without the need for a communication interface transmission for each frame of the DMD real-time exposure image, reducing the amount of transmitted data and effectively reducing the transmission of the communication interface The speed limits the lithography efficiency. In the actual exposure stage, the exposure image information is directly obtained from the external storage device, and based on the exposure image information, the DMD micromirror array is automatically controlled to complete the rapid flip, giving full play to the high-speed data transmission and the hardware control board. The advantage of powerful timing control ability greatly shortens the data transmission time, improves the DMD image exposure speed, and improves the working efficiency of the DMD maskless lithography machine.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

PCB production process based on laser direct writing exposure

The invention provides a PCB production process based on laser direct writing exposure. The PCB production process comprises the steps of S1, vacuum pressing; s2, horizontal copper deposition; s3, VCP electroplating is carried out; s4, automatically pasting a dry film; s5, performing laser direct writing exposure; s6, developing the dry film; s7, carrying out acid etching; and S8, solder resist printing. According to the method, the PCB is produced in a mode of combining VCP electroplating and laser direct writing exposure, through pulse current VCP electroplating, the copper plating depth capacity reaches 100%, the thickness ratio of hole copper to surface copper of a plating layer is 1: 1, the product quality is remarkably improved, and the production cost is reduced. A circuit film does not need to be manufactured through laser direct writing exposure, the problem of circuit exposure deviation caused by expansion and shrinkage of a circuit negative film is solved, the problem of insufficient exposure or overexposure caused by insufficient energy is solved, the exposure speed is high, the efficiency is high, the quality of a final PCB product is remarkably improved through VCP electroplating, the production cost is reduced, and the economic benefit is improved; the method has market application prospects and market popularization values.
Owner:广德东风电子有限公司

A kind of laser processing method of solder mask layer of circuit board

The invention discloses a method for machining a solder mask of a circuit board through a laser. The method comprises the step of performing preprocessing, coating printing and exposure and removing an unnecessary soldering preventing green paint protection layer through the laser. The development technology is replaced by the technology of removing the protection layer through the laser, waste water is not produced, environmental friendliness is achieved, energy is saved, and production cost of enterprises can be reduced. In the exposure step, the soldering preventing green paint protection layer can be directly exposed through a high-energy UV light source, the exposure speed is high, the whole face of the circuit board is directly irradiated in the exposure process, a light painting film shade does not need to be adopted, the pre-drying and post-drying steps can be omitted, the production technology is simplified, and the production cycle of products can be shortened. In the step of removing the unnecessary soldering preventing green paint protection layer through the laser, laser dynamic scanning is adopted, an image scanned by the laser can be dynamically adjusted according to deformation of the circuit board, and the quality of the products is improved.
Owner:ZHONGSHAN AISCENT TECH

A kind of high-sensitivity environment-friendly one-component rotary mesh photoresist and its preparation method and application

The invention relates to a new environment-friendly photosensitive polymer material, in particular to a high-sensitivity environment-friendly single-component rotary mesh photosensitive adhesive and a preparation method and application thereof. The high-sensitivity and environment-friendly one-component rotary network photosensitive adhesive of the present invention is mainly composed of a thermosetting resin, a latent curing agent, a toughening resin, a photocurable resin, a photopolymerization initiator, a sensitizer, a free radical scavenger and an additive. The self-emulsifying process is used to make high-sensitivity and environmental-friendly one-component rotary screen photosensitive adhesive. Due to the efficient sensitization reaction of the photosensitive system, a high-sensitivity photosensitive speed and an ultra-high resolution of 20um are obtained; the environmentally friendly one-component rotary screen photosensitive adhesive made from this can be stored stably for a long time, not only can replace the traditional Bichromate / PVA and other two-component photosensitive systems solve the problem of hexavalent chromium heavy metal pollution in the prior art, and its exposure speed is extremely fast, which can be quickly exposed and cured under low ultraviolet energy under DMD lithography rays to complete fine The requirements for rapid mesh making of the pattern are suitable for the rapid mesh making of DMD lithography technology.
Owner:浙江易能感光材料有限公司

Thin film transistor liquid crystal display (TFT-LCD) array substrate and manufacturing method thereof

The invention relates to a thin film transistor liquid crystal display (TFT-LCD) array substrate and a manufacturing method thereof. The manufacturing method comprises the following steps of: depositing a grid metal film, a grid insulation layer and a semiconductor film to form a figure comprising a grid line and a quasi semiconductor layer; depositing a passivation layer to form a semiconductor layer figure, a figure comprising a source electrode via hole and a drain electrode via hole on the semiconductor layer, and a doped semiconductor layer on the surface of the semiconductor layer in the source electrode via hole and the drain electrode via hole; and depositing a transparent conductive film and a source and drain metal film to form a figure comprising a pixel electrode, a data line,a source electrode and a drain electrode, wherein the source electrode is connected with the semiconductor layer through the doped semiconductor layer in the source electrode via hole and the drain electrode is connected with semiconductor layer through the doped semiconductor layer in the drain electrode via hole. The TFT-LCD array substrate can be manufactured through three times of processes, so the process is relatively simple, the process time can be shortened to the maximum extent, the production efficiency is improved, and the production cost is reduced.
Owner:BOE TECH GRP CO LTD +1
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