30results about How to "Fast exposure" patented technology

A noise dosimeter with capability to rapidly predict noise exposure over an extended time period based on a measurement of short duration. Either an acoustic or an electrical earphone adapter provides a convenient means to connect the noise dosimeter to an external sound source. A direct input jack operable to receive at least one audio signal provides a signal to an RMS detector, which provides a DC signal to a two-stage amplifier circuit. The outputs of the amplifiers are provided to a processor having multiple A / D channels. The processor calculates accumulated noise doses and drives a display, which in one embodiment includes a panel of light-emitting diodes. In one embodiment, the dosimeter includes functionality for control of external devices such as sound boards.

The invention discloses a multi-band time-dividing optical exposure device and method, and belongs to the technical field of printed circuit boards. According to the method, light sources with different wavelengths are separated, on a set of photoelectric exposure device, a plurality exposure sub systems are adaptive, each exposure sub system is matched with the light sources with different wavelengths and spatial light modulators corresponding to different wavelength ranges to perform multi-time sequencing exposure for a substrate to be exposed, the exposure sub systems are arranged at intervals at different positions in the multi-band optical exposure device scanning direction according to the time required when exposure of the substrate to be exposed is performed by employing the lightsources with the matching wavelengths to allow different exposure sub systems to allow different exposure sub systems to have a certain time interval in the photochemical reaction at different depthsof the material or with different photoinitiators to allow the photochemical reaction to be more full and allow the exposed images to be better in glossiness and clearer.

The present invention relates to a kind of alkali water soluble resin of high refractive index, it is characterized in that it is obtained by the copolymerization of monofunctionality high refractive index monomer and acrylic acid or methacrylic acid or / and acrylate monomer; High refractive index alkaline water The weight-average molecular weight of the soluble resin is 2-150,000, the acid value is 50-100 mgKOH / g, and the refractive index is greater than or equal to 1.50. The invention also relates to a preparation method of the high-refractive-index alkali-water-soluble resin and a high-refractive-index photoresist containing the high-refractive-index alkali-water-soluble resin. The invention has the advantage that the alkali water-soluble resin with high refractive index and the photoresist with high refractive index have higher refractive index and light transmittance.

The invention discloses a method for machining a solder mask of a circuit board through a laser. The method comprises the step of performing preprocessing, coating printing and exposure and removing an unnecessary soldering preventing green paint protection layer through the laser. The development technology is replaced by the technology of removing the protection layer through the laser, waste water is not produced, environmental friendliness is achieved, energy is saved, and production cost of enterprises can be reduced. In the exposure step, the soldering preventing green paint protection layer can be directly exposed through a high-energy UV light source, the exposure speed is high, the whole face of the circuit board is directly irradiated in the exposure process, a light painting film shade does not need to be adopted, the pre-drying and post-drying steps can be omitted, the production technology is simplified, and the production cycle of products can be shortened. In the step of removing the unnecessary soldering preventing green paint protection layer through the laser, laser dynamic scanning is adopted, an image scanned by the laser can be dynamically adjusted according to deformation of the circuit board, and the quality of the products is improved.

The present invention disclosed a multi -band optical exposure system, equipment and methods, which belong to the field of printing line board technology.The multi -wave segment optical exposure system, equipment and methods provided by the present invention can increase the service life of optical devices by separating different wavelength light sources.The system is set in different positions in the direction of the optical exposure system of multi -band optical exposure system, so that different exposure subsystems can be realized in different depths of the material, or a certain time interval between photochemical reactions with different optical reactions, making the optical chemical reaction more more more than a more chemical reaction.Fully allows the graphic gloss of composite light -sensitive materials to better gloss and higher definition, and at the same time, the overall production capacity and work efficiency of the exposure equipment have been improved.

The invention relates to a new environment-friendly photosensitive polymer material, in particular to a high-sensitivity environment-friendly single-component rotary mesh photosensitive adhesive and a preparation method and application thereof. The high-sensitivity and environment-friendly one-component rotary network photosensitive adhesive of the present invention is mainly composed of a thermosetting resin, a latent curing agent, a toughening resin, a photocurable resin, a photopolymerization initiator, a sensitizer, a free radical scavenger and an additive. The self-emulsifying process is used to make high-sensitivity and environmental-friendly one-component rotary screen photosensitive adhesive. Due to the efficient sensitization reaction of the photosensitive system, a high-sensitivity photosensitive speed and an ultra-high resolution of 20um are obtained; the environmentally friendly one-component rotary screen photosensitive adhesive made from this can be stored stably for a long time, not only can replace the traditional Bichromate / PVA and other two-component photosensitive systems solve the problem of hexavalent chromium heavy metal pollution in the prior art, and its exposure speed is extremely fast, which can be quickly exposed and cured under low ultraviolet energy under DMD lithography rays to complete fine The requirements for rapid mesh making of the pattern are suitable for the rapid mesh making of DMD lithography technology.

The invention discloses a clamping and lifting device, which includes a positioning component for connecting and clamping a plate, a lifting device for driving the positioning component to move to lift the plate, and controlling the positioning component and the lifting device to realize connection, clamping and clamping. Electric control system for lifting process. The positioning component is used for fast and accurate positioning of the semi-finished PCB board, clamping and fixing and releasing; the lifting device drives the positioning component to lift the semi-finished PCB board to separate the attached film for subsequent position adjustment operations without manual adjustment Positioning, the whole process is realized by the driving parts and actuators under the control of the electronic control system. It has the advantages of rapid action, high efficiency, accurate alignment, and easy operation. It replaces the previous manual alignment operation and manual repetition with automation. Heavy work, significantly improving production efficiency.

The invention discloses an exposure adjustment method and device, a camera and a computer storage medium, which belong to the technical field of cameras, and are used to use the brightness value after the adjustment takes effect as the basis for exposure adjustment, so as to alleviate the overshoot problem in the prior art . The method includes: according to the captured brightness value of the current picture and the historical exposure parameter value corresponding to the brightness value of the current picture, obtaining an estimated brightness value after the last output exposure parameter value setting takes effect, wherein the exposure parameter includes Gain, shutter or aperture; determine whether the ratio of the target brightness value to the estimated brightness value is within a preset range; when it is determined that the ratio of the target brightness value to the estimated brightness value is not within a preset range, according to the Determine a new exposure parameter value based on the ratio of the target brightness value to the estimated brightness value, and perform exposure adjustment according to the new exposure parameter value.

The invention discloses a fabrication method of the T type gate of a high-ion mobility transistor. The method includes the following steps that: an anti-reflection layer and first photoresist are sequentially formed on a gallium arsenide (GaAs) substrate; the first photoresist is subjected to exposure and development, so that a display area of which the width ranges from 0.16 to 0.19 microns can be formed, and the display area is further subjected to a chemical shrinkage process, so that the width of the display area can be decreased to a range from 0.11 to 0.13 microns; and the display area of the first photoresist is coated with second photoresist, and the second photoresist is subjected to exposure and development, so that the exposed and developed second photoresist and the display area of the first photoresist can jointly form an etching window of the T type gate, and the T type gate of which the width ranges from 0.11 to 0.13 microns can be formed through metal deposition. The fabrication method of the invention has the advantages of low equipment input and high production capacity, and can effectively reduce production cost and is suitable for practical production application.

The invention relates to a thin film transistor liquid crystal display (TFT-LCD) array substrate and a manufacturing method thereof. The manufacturing method comprises the following steps of: depositing a grid metal film, a grid insulation layer and a semiconductor film to form a figure comprising a grid line and a quasi semiconductor layer; depositing a passivation layer to form a semiconductor layer figure, a figure comprising a source electrode via hole and a drain electrode via hole on the semiconductor layer, and a doped semiconductor layer on the surface of the semiconductor layer in the source electrode via hole and the drain electrode via hole; and depositing a transparent conductive film and a source and drain metal film to form a figure comprising a pixel electrode, a data line,a source electrode and a drain electrode, wherein the source electrode is connected with the semiconductor layer through the doped semiconductor layer in the source electrode via hole and the drain electrode is connected with semiconductor layer through the doped semiconductor layer in the drain electrode via hole. The TFT-LCD array substrate can be manufactured through three times of processes, so the process is relatively simple, the process time can be shortened to the maximum extent, the production efficiency is improved, and the production cost is reduced.