High-speed continuous automatic exposure machine

Abstract

The invention discloses a high-speed continuous automatic exposure machine, and the exposure machine comprises a supporting table; a plurality of supporting columns are fixedly connected to the upperend of the supporting table, a working table plate is connected to the upper ends of the supporting columns in a solitary manner, a connecting frame is fixedly connected to the rear portion of the upper end of the working table plate, and a transverse moving mechanism is fixedly connected to the upper portion of the front end of the connecting frame. A lifting mechanism is movably connected to thefront portion of the transverse moving mechanism, a first machine base is fixedly connected to the middle of the upper end of the connecting frame, a first motor is fixedly connected to the upper endof the first machine base, a supporting frame is fixedly connected to the left portion of the upper end of the connecting frame, and an exposure device is fixedly connected to the front portion of the lower end of the supporting frame. According to the high-speed continuous automatic exposure machine, the feeding, exposure, feeding and other operation processes are fully automatic, the exposure speed is high, an operator does not need to carry out frame placing preparation, unnecessary waiting time is saved, production efficiency is improved, productivity is improved, and electric energy consumption can be reduced.

Description

technical field [0001] The invention relates to the technical field of exposure machines, in particular to a high-speed continuous automatic exposure machine. Background technique [0002] With the development of electronic technology, the application of circuit boards (PCB / FPC, etc.) is becoming more and more extensive, and the technical requirements for its processing and manufacturing are getting higher and higher. Usually, circuit board exposure is an important process in the circuit board manufacturing process, which is divided into three cases: inner layer exposure, outer layer exposure and solder mask exposure. At present, the exposure of the circuit board is usually implemented in an exposure machine. The first exposure machine includes a CCD mechanism, an alignment mechanism and a light source mechanism. The CCD mechanism and the alignment mechanism cooperate to complete the alignment of the circuit board, and the light source mechanism completes the exposure. In t...

AI Technical Summary

Problems solved by technology

In the traditional technology, the semi-automatic solder mask exposure machine adopts the mode of double frames alternately entering and exiting. The limitation of this method is that due to the high energy required for the solder mask exposure process and the long exposure time, when the product exposure in the exposure area is not completed, the operation If the workers are ready to put the frame, they need to wait, which will not only reduce the production efficiency and affect the production capacity, but also consume more electric energy

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