PCB production process based on laser direct writing exposure

A production process and laser direct writing technology, which are applied in microlithography exposure equipment, photolithography process of pattern surface, photolithography process exposure device, etc., can solve problems such as high cost and poor heat dissipation effect, and improve product quality. , scientific and reasonable design, high efficiency

Active Publication Date: 2022-03-01
广德东风电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This technical means is costly, and the heat dissipation effect is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A PCB production process based on laser direct writing exposure, specifically including the following steps:

[0030] S1. Vacuum lamination: stack the layers of the PCB board in order, and place the stacked layers under the vacuum sub-lamination machine for vacuum lamination. Control the vacuum lamination temperature to ≤20°C and the vacuum degree to -0.1 MPa, repeatedly press the stacked boards until the thickness of the boards does not change, and perform cutting, filleting, chamfering and drilling on the laminated boards;

[0031] S2. Horizontal copper sinking: Deburr the opening of the pressed copper clad laminate, and soak it in the degreasing liquid to remove the oil stains. When degreasing, ensure that the concentration of the degreasing liquid backflow cycle is uniform, and then clean the base material at the drilled hole Open micro pits with a roughening solution, place the copper clad laminate horizontally in the copper sinking tank, pre-plate copper through c...

Embodiment 2

[0047] The difference between this embodiment and embodiment 1 is:

[0048] The copper plating solution for electrochemical copper plating is: copper sulfate 20g / L, sulfuric acid 5g / L, sodium polydisulfide dipropane sulfonate 2g / L, sodium tartrate 10g / L, formaldehyde 3g / L, sodium citrate 10g / L , a mixture of artificial plasma 25g / L, ammonium bromide 10g / L and deionized water.

[0049] The copper solution for VCP electroplating is a mixture of copper sulfate 45g / L, potassium dihydrogen phosphate 20g / L, dipotassium hydrogen phosphate 15g / L, artificial plasma 25g / L, ammonium bromide 10g / L and deionized water.

[0050] The special copper plating brightener for VCP electroplating is: copper sulfate 4.5g / L, zinc sulfate 50g / L, sulfuric acid 50g / L, saccharin 1.5g / L, citric acid 5g / L, diamine blue 0.015g / L, twelve A mixture of sodium alkylsulfonate 4g / L, sodium lauryl sulfate 2g / L and deionized water.

[0051] The positive and negative current ratio of VCP plating is 1:1, the positi...

Embodiment 3

[0057] The copper plating solution for electrochemical copper plating is: copper sulfate 50g / L, sulfuric acid 5g / L, sodium polydisulfide dipropane sulfonate 5g / L, sodium tartrate 10g / L, formaldehyde 8g / L, sodium citrate 5g / L , a mixture of artificial plasma 25g / L, ammonium bromide 5g / L and deionized water.

[0058] The copper solution for VCP electroplating is a mixture of copper sulfate 30g / L, potassium dihydrogen phosphate 20g / L, dipotassium hydrogen phosphate 10g / L, artificial plasma 25g / L, ammonium bromide 5g / L and deionized water.

[0059] The special copper plating brightener for VCP electroplating is: copper sulfate 4.5g / L, zinc sulfate 50g / L, sulfuric acid 100g / L, saccharin 1.5g / L, citric acid 5g / L, diamine blue 0.005g / L, twelve A mixture of sodium alkylsulfonate 4g / L, sodium lauryl sulfate 2g / L and deionized water.

[0060] The positive and negative current ratio of VCP plating is 1:1, the positive and negative current time is 1:1, the VCP plating temperature is cont...

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PUM

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Abstract

The invention provides a PCB production process based on laser direct writing exposure. The PCB production process comprises the steps of S1, vacuum pressing; s2, horizontal copper deposition; s3, VCP electroplating is carried out; s4, automatically pasting a dry film; s5, performing laser direct writing exposure; s6, developing the dry film; s7, carrying out acid etching; and S8, solder resist printing. According to the method, the PCB is produced in a mode of combining VCP electroplating and laser direct writing exposure, through pulse current VCP electroplating, the copper plating depth capacity reaches 100%, the thickness ratio of hole copper to surface copper of a plating layer is 1: 1, the product quality is remarkably improved, and the production cost is reduced. A circuit film does not need to be manufactured through laser direct writing exposure, the problem of circuit exposure deviation caused by expansion and shrinkage of a circuit negative film is solved, the problem of insufficient exposure or overexposure caused by insufficient energy is solved, the exposure speed is high, the efficiency is high, the quality of a final PCB product is remarkably improved through VCP electroplating, the production cost is reduced, and the economic benefit is improved; the method has market application prospects and market popularization values.

Description

technical field [0001] The invention relates to the technical field of PCB board production and preparation, in particular to a PCB production process based on laser direct writing exposure. Background technique [0002] Printed circuit board (PCB), also known as printed circuit board, printed circuit board, or printed board for short, usually uses an insulating board as the base material, on which at least one conductive pattern is attached, and is equipped with such as component holes, fastening holes, metal Pore ​​structures such as chemical holes are used to replace the chassis of traditional electronic components and realize the interconnection of electronic components. With the rapid development and popularization of smart electronic products, and the continuous development in the direction of thinning and high density, the requirements for the output and quality of PCB are getting higher and higher, and the wiring of PCB is becoming more and more dense, which makes th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/06G03F7/20
CPCH05K3/188H05K3/06G03F7/70025G03F7/2053
Inventor 沈海平沈哲严星冈韩建
Owner 广德东风电子有限公司
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