A multi-band optical exposure system, equipment and method

An optical exposure and exposure subsystem technology, applied in the field of printed circuit boards, can solve the problems of unstable energy output in the effective band, low service life of the coating layer, and increased input costs, etc., to improve the service life and energy utilization rate, Reduce the use cost and maintenance cost, improve the overall production capacity and work efficiency

Active Publication Date: 2021-06-11
JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above method of using high-pressure mercury lamps has the disadvantages of rapid attenuation of the mercury lamp light source, limited service life, unstable energy output in the effective band, wide spectral distribution, and low energy utilization efficiency. Due to the high pressure, high temperature and strong radiation of the mercury lamp, It is easy to make the surrounding oxygen molecules react chemically and produce ozone, which will cause certain pollution; while the mixed light source method needs to design a complex coating layer, the coating layer has a low service life, and causes energy loss. The mixed light source passes through the same set When using an optical system, it will seriously reduce the life of the optical device, thereby increasing the input cost; at the same time, the upper limit of the exposure energy will be limited, the design of the optical system is complicated, and the complex structure will increase the assembly error; moreover, the composite photosensitive material is suitable for light sources of different wavelengths The reaction time is different. When light sources of different wavelengths are exposed to the solder resist ink through the optical system, there must be an incomplete reaction under the same reaction time, which leads to the gloss and clarity of the exposed graphics not meeting the requirements. , the scrap rate is high; if repeated exposures are repeated, it will lead to a decrease in production capacity and low work efficiency

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  • A multi-band optical exposure system, equipment and method
  • A multi-band optical exposure system, equipment and method
  • A multi-band optical exposure system, equipment and method

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Embodiment 1

[0034] This embodiment provides a multi-band optical exposure system, the multi-band optical exposure system includes at least two groups of exposure subsystems, a calibration system and a motion platform;

[0035] The exposure subsystem is used to expose the substrate to be exposed; the calibration system is used to calibrate different exposure subsystems and each optical path in each exposure subsystem in a single direction, on a plane or in a spatial position to achieve different exposures The graphics formed by the subsystem when exposing the substrate to be exposed are superimposed at the same position; the motion platform is used to realize the movement of the substrate to be exposed in a single direction, on a plane or in a spatial position;

[0036] Among them, each group of exposure subsystems matches light sources of different wavelength ranges and optical devices corresponding to different wavelength ranges, and each group of exposure subsystems is set in multi-band ...

Embodiment 2

[0039] This embodiment provides a multi-band optical exposure system, the multi-band optical exposure system includes at least two groups of exposure subsystems, a calibration system and a motion platform;

[0040]The exposure subsystem is used to expose the substrate to be exposed; the calibration system is used to calibrate different exposure subsystems and each optical path in each exposure subsystem in a single direction, on a plane or in a spatial position to achieve different exposures The graphics formed by the subsystem when exposing the substrate to be exposed are superimposed at the same position; the motion platform is used to realize the movement of the substrate to be exposed in a single direction, on a plane or in a spatial position;

[0041] Among them, each group of exposure subsystems matches light sources of different wavelength ranges and optical devices corresponding to different wavelength ranges, and each group of exposure subsystems is set in multi-band ...

Embodiment 3

[0049] This embodiment provides a multi-band optical exposure equipment, please refer to figure 1 , the multi-band optical exposure equipment includes the multi-band optical exposure system described in Embodiment 1 or Embodiment 2;

[0050] In this embodiment, the multi-band optical exposure equipment includes two sets of exposure subsystems, and each set of exposure subsystems matches single-wavelength light sources of different wavelengths for illustration:

[0051] Because the wavelength is different, the interval time required for exposing the substrate to be exposed is also different. In order to make the exposure subsystem of the single-wavelength light source matching different wavelengths expose the solder resist ink, there is a time difference, so that the photochemical reaction is more sufficient. The graphics exposed on the composite photosensitive material have better gloss and higher definition, so the two sets of exposure subsystems are arranged at different pos...

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Abstract

The present invention disclosed a multi -band optical exposure system, equipment and methods, which belong to the field of printing line board technology.The multi -wave segment optical exposure system, equipment and methods provided by the present invention can increase the service life of optical devices by separating different wavelength light sources.The system is set in different positions in the direction of the optical exposure system of multi -band optical exposure system, so that different exposure subsystems can be realized in different depths of the material, or a certain time interval between photochemical reactions with different optical reactions, making the optical chemical reaction more more more than a more chemical reaction.Fully allows the graphic gloss of composite light -sensitive materials to better gloss and higher definition, and at the same time, the overall production capacity and work efficiency of the exposure equipment have been improved.

Description

technical field [0001] The invention relates to a multi-band optical exposure system, equipment and method, and belongs to the technical field of printed circuit boards. Background technique [0002] Composite photosensitive material is a photosensitive material that can produce photochemical reactions to light sources of various wavelengths. In the printed circuit board (Printed Circuit Board, PCB) industry in the field of integrated circuits, the light-cured solder resist used in the solder resist process Ink, because it is doped with photoinitiators of various wavelengths, is a typical composite photosensitive material. The basic composition of PCB solder resist ink is: prepolymer, reactive diluent, photoinitiator, pigment, additives, etc. In the solder resist process, the ultraviolet (ultra-violet, UV) curing of PCB solder resist ink relies on the photoinitiator to absorb the radiation energy of the ultraviolet light source to form free radicals, triggering the crosslin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/7005G03F7/70058G03F7/70208G03F7/7055
Inventor 陈海巍宋志尚李显杰钱聪程珂茆晓华吴长江徐敏王伟王军华刘世林袁征蒯多杰
Owner JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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