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Manipulator positioning device

A positioning device and manipulator technology, applied in the direction of manipulators, manufacturing tools, etc., can solve the problems of low repeatability, affecting the position accuracy of the manipulator to take and put the film, and the repeated positioning accuracy of the shock vibration level to improve the repeatability Accuracy, improvement of horizontal repeat positioning accuracy, and effect of reducing influence

Pending Publication Date: 2020-05-08
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the fit gap of the ball screw structure itself, the repeatability accuracy of the vertical reciprocating motion is low, and the vertical motion will affect the repeatability of the manipulator's horizontal positioning accuracy, which in turn will affect the accuracy of the manipul

Method used

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Embodiment Construction

[0038] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings but not all of them.

[0039] Such as Figure 3-Figure 5 As shown, this embodiment provides a positioning device for a manipulator, which is used for positioning the manipulator during the process of transferring the silicon wafer from the pre-alignment station to the workpiece table for taking and placing the wafer. The positioning device includes a base plate 1 , a slide plate 2 , a driving assembly, a positioning assembly and a shock absorbing assembly 3 . Wherein, the base plate 1 is fixed on the frame, and the slide plate ...

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Abstract

The invention relates to the technical field of photoetching equipment, in particular to a manipulator positioning device. A sliding plate of the positioning device is movably arranged on a base plate, and a driving assembly drives the sliding plate to do reciprocating motion in the vertical direction. A positioning assembly is arranged at the top end of the sliding plate and used for horizontallypositioning the manipulator, and a damping assembly is connected between the sliding plate and the positioning assembly and used for absorbing impact vibration generated when the manipulator makes contact with the positioning assembly. According to the manipulator positioning device, the sliding plate can do reciprocating motion in the vertical direction under the driving effect of the driving assembly, the repeatability precision during vertical reciprocating motion is effectively improved, therefore, the influence of vertical motion on the horizontal repeated positioning precision is reduced, and the horizontal repeated positioning precision of the mechanical arm is improved; and by arranging the damping assembly, impact vibration generated when the manipulator is positioned can be effectively absorbed, the horizontal repeated positioning precision of the manipulator is further improved, and therefore the repeated precision of silicon wafer transferring and wafer feeding positions is improved.

Description

technical field [0001] The invention relates to the technical field of photolithography equipment, in particular to a positioning device for a manipulator. Background technique [0002] In the silicon wafer transmission system of lithography equipment, it is necessary to use the manipulator to quickly, accurately and reliably transfer the silicon wafer from the pre-alignment station to the workpiece table. In order to ensure the position accuracy of the silicon wafer from the pre-alignment station to the workpiece table, the horizontal repeat positioning accuracy of the manipulator is required to reach 1 μm when taking and placing the wafer. In actual work, the positioning accuracy and repeatability accuracy of the end of the manipulator are low, and the repeatability accuracy is about 50 μm, while the advanced lithography machine has much higher requirements for the repeatability accuracy of silicon wafers. Therefore, only relying on the accuracy of the manipulator itself ...

Claims

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Application Information

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IPC IPC(8): B25J11/00B25J19/00
CPCB25J11/0095B25J19/0091
Inventor 文静张阔峰陶洪建郑锋标
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD