A Wafer Biscuit Cooling Grab Output Mechanism

Abstract

The invention discloses a cooling, grabbing and outputting mechanism for wafer biscuits, comprising a rack, an upper support frame is fixed on the top surface of the middle of the top plate of the rack, and the left and right sides of the rear top surface of the top plate of the rack are fixed with an upper support frame. Both are fixed with track bars, two track sliders are installed on the track bars, the horizontal plate is fixed on the top surfaces of the two track sliders, a moving block is fixed in the middle of the bottom surface of the horizontal plate, and the middle of the top surface of the top plate of the rack is The connecting plate is fixed to the rear part, the two ends of the moving screw are hinged on the two connecting plates through bearings, the main moving motor is fixed on the rear wall of the connecting plate at the rear, and the output shaft of the main moving motor is a spline shaft. The spline shaft is inserted into the spline hole provided at the rear end of the moving screw. The invention can speed up the cooling efficiency of the cakes, and at the same time, the cakes can be taken and placed automatically, which is very convenient, and at the same time, it has a protective effect to prevent the cakes from being polluted by dust and the like.

Description

Technical field: [0001] The invention relates to the technical field of food processing equipment, and more specifically relates to a wafer biscuit cooling grasping output mechanism. Background technique: [0002] The existing wafer biscuit production process includes batter stirring, pie baking, pie cooling, pie coating, pie cooling, and cutting. The pie cooling is an important process, which requires the heated pie Or coated with a cream coating for cooling, the existing cooling method is to directly place the cake on the cooling table for natural cooling, the cooling efficiency is relatively low, the effect is not ideal, and there is no natural cooling place The protective mechanism is easy to make dust and other debris on the cake, affecting the effect. [0003] And the cooled pie slices are taken and placed manually, which is very troublesome. Invention content: [0004] The purpose of the present invention is to overcome the deficiencies of the prior art, and provi...

AI Technical Summary

Problems solved by technology

[0002] The existing wafer biscuit production process includes batter stirring, pie baking, pie cooling, pie coating, pie cooling, and cutting. The pie cooling is an important process, which requires the heated pie Or coated with a cream coating for cooling, the existing cooling method is to directly place the cake on the cooling table, natural cooling, its cooling efficiency is relatively low, the effect is not ideal, and there is no natural cooling place Protective mechanism, easy to make dust and other debris on the cake, affecting the effect

[0003] Moreover, taking and placing the cooled pie slices is manual, which is very troublesome

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