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Temperature equalization plate and preparation method thereof

A technology of vapor chamber and cover plate, which is applied in the direction of lighting and heating equipment, indirect heat exchangers, etc., which can solve the problems of further improvement of heat dissipation performance, complicated preparation process, and complex structure, and achieve simple structure, simple process, and heat dissipation. good effect

Inactive Publication Date: 2020-05-08
东莞赛诺高德蚀刻科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the capillary structure of existing vapor chambers often adopts the capillary structure of welded copper mesh, but its structure is complex, thick, easy to deform, its preparation process is relatively complicated, and the heat dissipation performance needs to be further improved

Method used

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  • Temperature equalization plate and preparation method thereof
  • Temperature equalization plate and preparation method thereof
  • Temperature equalization plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A temperature chamber, comprising an upper cover plate 13 and a lower cover plate 14 connected to the upper cover plate 13, the upper cover plate 13 and the lower cover plate 14 surround and form a hollow chamber, and the hollow chamber is used to accommodate A working fluid is provided, and a capillary structure is provided in the chamber.

[0040] Further, the lower cover plate 14 includes a base plate and a frame 11 surrounding the periphery of the base plate, and the base plate, the frame 11 and the upper cover plate surround to form a hollow chamber.

[0041]Further, the capillary structure is disposed on the lower cover 14 , and the capillary structure is attached to the inner surface of the substrate. The capillary structure includes a base layer and a protrusion 12 protruding from the base layer, and the base layer is attached to the inner surface of the lower cover plate 14 .

[0042] Further, a plurality of supporting protrusions 15 are arranged in the chambe...

Embodiment 2

[0063] A temperature chamber, comprising an upper cover plate 13 and a lower cover plate 14 connected to the upper cover plate 13, the upper cover plate 13 and the lower cover plate 14 surround and form a hollow chamber, and the hollow chamber is used to accommodate A working fluid is provided, and a capillary structure is provided in the chamber.

[0064] Further, the lower cover 14 includes a base plate and a frame 11 surrounding the periphery of the base plate, and the base plate, the frame 11 and the upper cover plate surround to form a hollow chamber.

[0065] Further, the capillary structure is divided into a first capillary structure disposed on the upper cover 13 and a second capillary structure disposed on the lower cover 14 . The first capillary structure is attached to the inner surface of the upper cover 13 . The second capillary structure is attached to the inner surface of the substrate.

[0066] Further, the capillary structure includes a base layer and a prot...

Embodiment 3

[0085] The difference between this embodiment and Embodiment 1 is that in this embodiment, the capillary structure is arranged on the upper cover plate 13 .

[0086] A method for preparing the above-mentioned vapor chamber, comprising the steps of:

[0087] (1) Get the sheet metal and process it into the required shape according to the specifications of the upper cover plate 13 and the lower cover plate 14;

[0088] (2) Electroplating or sintering the capillary structure on the upper cover plate 13 and the lower cover plate 14;

[0089] (3) Flux the upper cover plate 13 and the lower cover plate 14, and reserve the liquid inlet of the working fluid;

[0090] (4) Vacuumize through the liquid inlet and inject the working fluid;

[0091] (5) Seal the liquid inlet to obtain a vapor chamber.

[0092] Further, both the upper cover plate 13 and the lower cover plate 14 are provided with supporting bosses 15 .

[0093] Further, in the step (2), electroplating the capillary structure...

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Abstract

The invention relates to the technical field of temperature equalization plates, and particularly discloses a temperature equalization plate and a preparation method thereof. The temperature equalization plate comprises an upper cover plate and a lower cover plate connected with the upper cover plate, a hollow cavity is defined by the upper cover plate and the lower cover plate and used for containing a working fluid, and a capillary structure is arranged in the cavity. The preparation method of the temperature equalization plate is convenient to operate and control, high in production efficiency, low in production cost and suitable for large-scale industrial production, thus the prepared product is stable in quality, simple in structure, small in thickness, not prone to deforming, good inheat dissipation performance, good in corrosion resistance and long in service life, and compared with an in-situ welded copper mesh capillary structure adopted by a temperature equalization plate inthe prior art, the prepared temperature equalization plate is simpler in structure, smaller in thickness, better in heat dissipation performance and longer in service life.

Description

technical field [0001] The invention relates to the technical field of uniform temperature plates, and in particular discloses a uniform temperature plate and a preparation method thereof. Background technique [0002] The Vapor Chamber is a plate-shaped heat pipe that injects working fluid into the internal vacuum environment, and performs the function of heat exchange through the liquid-gas phase change of the working fluid. Existing vapor chambers have a plate-like shape, and are generally composed of two-phase cover plates. The two plate surfaces with large surface areas are used as the heating end and the heat dissipation end respectively, and the conduction efficiency is higher. The chamber of the vapor chamber is usually provided with a capillary structure. However, the capillary structure of existing vapor chambers often adopts the capillary structure of welded copper mesh, but its structure is complex, thick, easy to deform, its preparation process is relatively co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04C25D5/18C25D5/10C25D3/38C25D5/16
CPCC25D3/38C25D5/10C25D5/16C25D5/18F28D15/04
Inventor 王文涛张亮旗王世权
Owner 东莞赛诺高德蚀刻科技有限公司
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