Heat dissipation system for passive heat dissipation of computer

A cooling system, passive technology, applied in computing, instruments, electrical and digital data processing, etc., can solve the problems of inconvenient maintenance, hidden dangers of computer security, easy to cause failure, etc., to improve the service life and use safety, improve heat extraction and heat transfer efficiency, the effect of reducing the speed of temperature transmission

Pending Publication Date: 2020-05-08
湖南玖泓节能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The air-cooled heat dissipation system includes a heat sink and a cooling fan. The principle is to conduct the heat from the heat source to the heat sink, and then drive the air to flow through the fan to achieve heat dissipation; the disadvantage is that in order to ensure the effectiveness of the fan cooling, the computer case must be It is designed as an open structure, so that the interior of the chassis can communicate with the outside world. After a long period of use, the fan will bring the external dust into the machine, which not only affects the cleanliness of the interior of the chassis, but also a large amount of dust accumulated on the heat sink will easily cause heat sink damage. Reduced cooling effect or even failure
[0005] The water-cooling system includes pipelines, water-cooling liquid, and water pumps. The principle is to generate pressure through the water pump to circulate the water-cooling liquid along the pipelines inside the chassis to take away heat. The disadvantage is that the water-cooling system must be completely sealed, but the pipeline There are too many connection points, which put forward high requirements for the production and installation process. Once a certain connection point leaks, it will cause serious safety hazards to the computer. At the same time, the water pump itself is an electrical product with a low safety factor. Not only does it consume a lot of power, but it is also prone to malfunctions during use and is not easy to maintain. Once the water pump stops working, there will be problems with the entire water-cooling system, which cannot dissipate heat and cause damage to the computer.

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  • Heat dissipation system for passive heat dissipation of computer
  • Heat dissipation system for passive heat dissipation of computer
  • Heat dissipation system for passive heat dissipation of computer

Examples

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Embodiment 1

[0035] see Figure 1~6 , a heat dissipation system for passive cooling of computers, comprising a housing 1, a CPU heat dissipation device 2 and a heat source heat dissipation device 3, the CPU heat dissipation device 2 includes a heat dissipation cover 23 with heat dissipation ribs 231 on the outer surface, the The heat dissipation cover 23 is connected with the housing 1 to form a fully enclosed case.

[0036] The CPU cooling device 2 also includes a first heat extractor 21 , a first heat transfer pipe 22 , a heat extractor cover 24 and a heat extractor bottom plate 25 located in the case. The heat-taking bottom plate 25 is fixedly connected to the CPU on the computer motherboard 01, the surface of the heat-taking bottom plate 25 is provided with a group of microgrooves for taking heat from the CPU, and heat-conducting silicone grease is applied at the heat-taking connection position of the two, The heat-taking end of the first heat collector 21 is fixedly connected to the ...

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PUM

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Abstract

The invention provides a heat dissipation system for passive heat dissipation of a computer. The system is characterized by comprising a shell, a CPU heat dissipation device and a heating source heatdissipation device, the CPU heat dissipation device comprises a heat dissipation cover, heat dissipation ribs are arranged on the outer surface of the heat dissipation cover, the heat dissipation cover is connected with the shell to form a fully-closed case, and an inert gas is filled in the case; the CPU heat dissipation device further comprises a first heat collector located in the case and connected with a CPU and a first heat transfer pipe arranged on the inner surface of the heat dissipation cover in a coiled mode and connected with the first heat collector; the heating source heat dissipation device is arranged in the case and comprises a second heat collector connected with the heating element and a second heat transfer pipe connected with the second heat collector and the inner surface of the shell; and the areas, not making contact with the heat transfer pipe, of the inner surfaces of the heat dissipation cover and the shell are covered with heat insulation coatings, and heatconduction silicone grease is smeared at the connecting positions of all devices. Passive heat dissipation of the computer is achieved, the excellent heat dissipation effect is achieved, meanwhile, the service life of heat dissipation equipment is prolonged, and the use safety of the heat dissipation equipment is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation system for passive heat dissipation of a computer. Background technique [0002] When the computer is working, the operation of its internal components will generate a lot of heat. If there is no heat dissipation system to discharge the heat in time, it will seriously affect the normal operation of the computer, resulting in slow operation of the computer, crashes, and even possible CPU failures. Core components are burned and other issues. [0003] Existing computer heat dissipation methods are generally divided into water-cooled heat dissipation and air-cooled heat dissipation, both of which belong to active heat dissipation. [0004] The air-cooled heat dissipation system includes a heat sink and a cooling fan. The principle is to conduct the heat from the heat source to the heat sink, and then drive the air to flow through the fan to achieve heat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 梁志刚李兵
Owner 湖南玖泓节能科技有限公司
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