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Micro-component transfer device and method of making the same

A technology of a transfer device and a manufacturing method, which is applied in the fields of semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., and can solve problems such as the inability to realize batch transfer of micro-components

Active Publication Date: 2021-10-22
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present application provides a transfer device for micro components and its manufacturing method to solve the problem that batch transfer of micro components cannot be realized in the prior art

Method used

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  • Micro-component transfer device and method of making the same
  • Micro-component transfer device and method of making the same
  • Micro-component transfer device and method of making the same

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Embodiment Construction

[0026] In order to enable those skilled in the art to better understand the technical solution of the present application, a micro-element transfer device and its manufacturing method provided by the invention will be further described in detail below with reference to the drawings and specific embodiments.

[0027] The transfer device of the present application is used to realize the transfer of micro-components. Taking the micro-LED display panel as an example, the transfer device of the present application can realize the selective transfer of batches of micro-LEDs. Other micro components having the same tiny features as micro light emitting diodes can be selectively transferred in batches by using the transfer device of the present application. Micro-light-emitting diodes, that is, the micro-components described in this application, are used to realize the self-illumination of pixels in the display panel. One micro-component is used as a pixel. In the current display panel,...

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Abstract

The present application discloses a transfer device for micro components and a manufacturing method thereof, wherein the transfer device includes a substrate, metal wiring and a plurality of silicon electrodes. Metal wiring is formed on the flat surface of the substrate, including a plurality of electrode driving units. The silicon electrodes are formed on the side of the metal wiring facing away from the substrate, and each silicon electrode is arranged corresponding to an electrode driving unit, and is driven by the electrode driving unit to pick up or release micro components. The transfer device provided by the present application can realize the transfer of a large number of micro components through electrostatic adsorption, which greatly improves the transfer efficiency.

Description

technical field [0001] The present application relates to the technical field related to micro-components, in particular to a micro-component transfer device and a manufacturing method thereof. Background technique [0002] In the equipment used in people's daily life, the miniaturization of components has become one of the development trends. For example, the application of micro-light-emitting diodes (Micro-LEDs) in display Emitting Diode) has become one of the development directions of current display technology. Specifically, because micro-light emitting diodes have extremely high luminous efficiency and lifespan, more and more companies have begun to develop micro-light-emitting diode display panels, and micro-light-emitting diodes are expected to become the next-generation display technology. [0003] For the current manufacture of micro light emitting diode display panels, due to the limitation of the preparation process, it is impossible to achieve efficient mass tr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L33/00
CPCH01L21/6833H01L33/0095H01L21/683H01L33/00H01L21/677
Inventor 陈博邢汝博郭恩卿李晓伟韦冬
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD