Strain coordination layer for integrated integral molding of ablation and heat protection structure, preparation method and application thereof
A technology of integral molding and coordinating layers, applied in the direction of chemical instruments and methods, applications, synthetic resin layered products, etc., can solve the problems that cannot meet the heat-proof structure of the adhesive film, the debonding of the heat-proof layer and the metal cabin, and achieve Avoid the risk of cracking and debonding, achieve shear strength and peel strength requirements, and improve impact resistance
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Embodiment 1
[0057] In this embodiment, the cabin structure is composed of a metal cabin, a strain coordination layer, and an ablation heat protection layer. The material of the metal cabin is 2A12 aluminum alloy, which is formed by a spinning process. The strain coordination layer is a high temperature resistant phenolic modified epoxy resin system (80 parts of barium phenolic resin, 30 parts of bisphenol A epoxy resin and 8 parts of solid nitrile rubber), and the thickness is 0.8mm. The ablation-resistant fiber fabric in the ablation heat protection layer is a high-silica fiber plain fabric, and the ablation-resistant resin is barium phenolic resin. The prepreg tape is made by solution method. The width of the tape is 80mm. , the thickness is 8mm.
[0058] The strain coordination layer is prepared in the following manner: the components used for preparing the high temperature resistant phenolic modified epoxy resin system are stirred at a constant temperature of 120° C. for 3 hours unde...
Embodiment 2
[0068] The method is basically the same as that of Example 1, except that the raw materials used to prepare the high temperature resistant phenolic modified epoxy resin system are 40 parts of barium phenolic resin, 50 parts of bisphenol A epoxy resin and 15 parts of barium phenolic resin. Parts of solid nitrile rubber.
Embodiment 3
[0070] The method is basically the same as that in Example 1, except that the raw materials used for preparing the high temperature resistant phenolic modified epoxy resin system are composed of 120 parts of barium phenolic resin, 10 parts of bisphenol A epoxy resin and 15 parts of phenolic resin. Parts of solid nitrile rubber.
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