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Circuit board rolling and film pasting device

A technology of membrane device and plate roller, which is applied in the directions of printed circuit, printed circuit manufacturing, and secondary treatment of printed circuit, etc. It can solve problems such as difficulty in increasing adhesion and difficult control of pressure, and achieves improved fluidity, increased film laminating speed, and guaranteed The effect of film quality

Pending Publication Date: 2020-05-12
GUANGDONG SOWOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a circuit board rolling film laminating device to solve the problems in the prior art that the circuit board film laminating device is difficult to control the pressure and the adhesion force is difficult to improve

Method used

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  • Circuit board rolling and film pasting device
  • Circuit board rolling and film pasting device
  • Circuit board rolling and film pasting device

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Experimental program
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specific Embodiment approach

[0048] Furthermore, please also refer to Figure 4 with Figure 5 , as a specific embodiment of the circuit board rolling film sticking device provided by the present invention, the circuit board rolling film sticking device also includes a guide sleeve 331 for guiding the pressure sensor 33 to rise and fall, the pressure sensor 33 is installed in the guide sleeve 331, and guides The sleeve 331 is installed on the support platform 312 . The guide sleeve 331 can play a guiding role when the pressure sensor 33 moves up and down, so that the pressure sensor 33 can monitor more accurately. In addition, the guide sleeve 331 can also play a role in protecting the pressure sensor 33 .

[0049] Furthermore, please also refer to Figure 4 with Figure 5 , as a specific embodiment of the circuit board rolling film laminating device provided by the present invention, each support 31 is provided with an upper shaft hole (not marked in the figure), and an upper bearing bush 311 is arran...

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PUM

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Abstract

The invention provides a circuit board rolling and film pasting device, which comprises a film supply mechanism, two hot pressing rollers and a rack, wherein the two hot pressing rollers are an upperpressing roller and a lower pressing roller which are vertically arranged side by side, support seats are installed on the rack, and the circuit board rolling and film pasting device further comprisesan air cylinder, a pressure sensor, a controller for controlling the air cylinder to drive air pressure and vibration sources for driving the upper pressing roller to vibrate at high frequency. According to the invention, the support seats are slidably mounted on the two sides of the rack, the upper pressing roller is slidably supported on the rack through the support seats, and the air cylinderis arranged on the rack so as to adjust the film pasting pressure; the pressure sensor is arranged on the support seat so as to monitor the film pasting pressure in real time, so that the film pastingpressure is controlled; and the vibration sources are arranged on the support seats, so that the upper pressing roller vibrates at high frequency during film pasting, the fluidity of a dry film blocking agent is greatly improved, the pit filling capacity and speed are improved, and the adhesive force of a dry film and copper foil is improved so as to ensure the film pasting quality and the film pasting speed.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and more specifically relates to a circuit board rolling film laminating device. Background technique [0002] In the film pasting industry, the dry film with a resist is generally hot-pressed and pasted on the circuit board; especially in the process of pasting the dry film on the precision circuit board (PCB) and flexible circuit board (FPC), the quality of the dry film It is mainly limited by the uniformity of temperature and pressure and the coordination of speed. The adhesion between dry film and copper foil directly determines the quality of the film. The adhesive force between the dry film and the copper foil on the circuit board is directly proportional to the pressure of the film laminating roller and inversely proportional to the film lamination speed. When pasting the film, the air cylinder is generally used to adjust the distance between the upper and lower heat rol...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 王建勋肖新建
Owner GUANGDONG SOWOTECH CO LTD