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Wafer back surface monitoring method

A wafer and backside technology, applied in the field of wafer backside monitoring, can solve the problem of few monitoring methods

Active Publication Date: 2020-05-19
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing process, there are many monitoring methods for the front of the wafer, but there are too few monitoring methods for the back of the wafer. Whether an effective method can be provided to monitor the back of the wafer is a method to improve customer satisfaction and improve The key to yield

Method used

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Embodiment Construction

[0017] The method for monitoring the backside of a wafer according to the present invention is mainly an improvement in view of the fact that the wafer light sheet and the wafer product or finished product are placed in a wafer cassette in different forms.

[0018] Since the surface of the ordinary wafer light sheet has not undergone thin film deposition and photolithography etc., the surface of the wafer still maintains a complete and flat shape. Such a wafer light sheet does not have other materials with different stresses and different properties superimposed on it. , it is only a single substrate material, so there is no obvious stress problem, so when it is placed in the wafer box, its shape is still flat without warping deformation, such as figure 1 As shown, the entire wafer is placed on the carrier in the wafer cassette, and the wafer is almost not warped.

[0019] On the wafer after multiple film formation and etching and patterning, due to the deposition of a variety...

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Abstract

The invention discloses a wafer back surface monitoring method, which comprises the following steps: providing a wafer light sheet without any pattern; firstly forming a dielectric layer on the waferlight sheet, and then coating a layer of photoresist on the dielectric layer; defining an edge removing area on the outermost periphery of the wafer through photoresist, and etching and removing the dielectric layer in the edge removing area of the outer ring; and removing the photoresist. The wafer light sheet provided by the invention can simulate the form of a normal wafer product or finished product in a wafer box, and can be used for qualification detection of maintenance completed equipment, or verification of equipment causing abnormality of the back surface of the wafer, or daily carrying test.

Description

technical field [0001] The invention relates to the field of manufacturing and testing of semiconductor integrated circuits, in particular to a method for monitoring the back of a wafer in a wafer manufacturing process. Background technique [0002] As customers have higher and higher requirements for the final shipment, the requirements for the back of the wafer are also becoming more and more stringent, and it is often required to monitor abnormalities on the back, such as scratches, stains, and gaps. The appearance of similar scratches and gaps will also be accompanied by the appearance of impurity particles. Containing this part of the source of impurities is also an improvement or improvement for the low yield caused by particles on the front side. [0003] In the existing process, there are many monitoring methods for the front of the wafer, but there are too few monitoring methods for the back of the wafer. Whether an effective method can be provided to monitor the b...

Claims

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Application Information

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IPC IPC(8): H01L21/311H01L21/66
CPCH01L21/31144H01L22/00
Inventor 蒋慧超
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP