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Chip package structure and manufacturing method thereof

A technology of chip packaging structure and manufacturing method, which is applied in the direction of radiating element structure, semiconductor/solid-state device manufacturing, antenna support/installation device, etc. Conducive to thinning, low manufacturing cost, and increased area

Active Publication Date: 2022-03-11
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the formation of antenna patterns usually requires etching and plating processes, making the cost high
In addition, the formed antenna pattern protrudes from the upper surface of the encapsulation layer, which is not conducive to the thinning of electronic devices

Method used

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  • Chip package structure and manufacturing method thereof
  • Chip package structure and manufacturing method thereof
  • Chip package structure and manufacturing method thereof

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Embodiment Construction

[0047] In order to make the description of the content of the present invention more detailed and complete, the following provides an illustrative description of the implementation structure and specific embodiments of the content of the present invention, but this is not the only form of implementing or using the specific embodiments of the content of the present invention. The various embodiments disclosed below can be combined or replaced with each other when beneficial, and other embodiments can also be added to one embodiment, without further description or illustration. In the following description, numerous specific details will be set forth in order to enable readers to fully understand the following embodiments. However, embodiments of this disclosure may be practiced without these specific details.

[0048] Specific examples of components and arrangements are described below for the purpose of simplifying the disclosure. Of course, these are examples only, and are n...

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PUM

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Abstract

A chip package structure, including a circuit redistribution structure, a chip, a package layer, and an antenna pattern. The circuit redistribution structure includes a first circuit layer, a second circuit layer, and a conductive pad. The second circuit layer is disposed on the first circuit layer and electrically connected with the first circuit layer. The conductive pad is electrically connected with the second circuit layer. The chip is arranged on the circuit redistribution structure and electrically connected with the second circuit layer. The encapsulation layer covers the chip and the circuit redistribution structure. The encapsulation layer has openings and grooves. The opening exposes the conductive pad, and a part of the groove communicates with the opening. The antenna pattern includes a first part and a second part. The first part covers the sidewall of the opening and is electrically connected to the conductive pad. The second part is filled in the groove and electrically connected with the first part. The manufacturing cost of the chip packaging structure disclosed here is low, and the antenna pattern does not protrude from the upper surface of the packaging layer, which is beneficial to the thinning of the electronic device. The area of ​​the antenna pattern is increased and the signal strength is improved.

Description

technical field [0001] The content of the present invention relates to a chip packaging structure and a manufacturing method of the chip packaging structure. Background technique [0002] Traditionally, in order to improve signal strength, antenna patterns are disposed on the encapsulation layer. However, forming an antenna pattern usually requires an etching process and an electroplating process, so that the cost remains high. In addition, the formed antenna pattern protrudes from the upper surface of the encapsulation layer, which is not conducive to thinning the electronic device. Contents of the invention [0003] One structure of the present invention is to provide a chip packaging structure. The chip package structure includes a circuit redistribution structure, a chip, a package layer, and an antenna pattern. The line redistribution structure includes a first line redistribution layer, a second line redistribution layer, and a conductive pad. The first line redi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/66H01L23/31H01L21/56H01Q1/22H01Q1/36
CPCH01L23/66H01L23/3107H01L21/56H01Q1/2283H01Q1/36H01L2223/6677
Inventor 陈建州简俊贤叶文亮林纬迪
Owner UNIMICRON TECH CORP